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This Government Contract opportunity from Department Of Defense was posted on August 12, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Military-Grade Packaging & Preservation

Closed
Federal

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The Military-Grade Packaging and Preservation subcontract, issued by the Department of Defense Active Devices Division, requires the packaging of electronic components in accordance with MIL-STD-2073-1E. The scope of work specifically mandates the use of dry and clean preservation under Method 41, which includes the strategic selection of appropriate containers and cushioning materials to ensure component integrity. This opportunity was posted on August 12, 2026, with a response deadline of August 24, 2026. The project falls under NAICS code 326199 and specifies a place of performance at FPO 09569.

General Info

DoD subcontract for MIL-STD-2073-1E electronic component packaging and preservation at FPO 09569.

NAICS

326199 - All Other Plastics Product Manufacturing

Place of Performance

FPO, AE, 09569, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-405J.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

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RELAY SUBASSEMBLY

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Packaging of electronic components per MIL-STD-2073-1E using dry/clean preservation (Method 41), including proper container and cushioning selection.

More opportunities from Department Of Defense → ACTIVE DEVICES DIVISION

Same awarding agency

NAICS: 334413
New
DIBBS
MICROCIRCUIT, MEMORY
Solicitation # SPE7M5-26-T-458G
Solicitation SPE7M5-26-T-458G is a small business set-aside request for quotation issued by the DLA Land and Maritime Active Devices Division for the procurement of two memory microcircuits, identified by NSN 5962015083931. The contract specifies a delivery timeframe of 154 days after award, with a need ship date of February 16, 2027, and an original required delivery date of September 7, 2027. Delivery is FOB Origin, while inspection and acceptance are conducted at the destination in Columbus, Ohio. The contract imposes rigorous quality and technical requirements, including mandatory supply chain traceability documentation and the submission of DLA Land and Maritime Form 918. Contractors are prohibited from shipping materials until the contract administrator provides written confirmation that the submitted traceability or test reports are adequate. Technical compliance includes adherence to MIL-STD-129 for marking, MIL-STD-2073-1E for packaging, and IPC/JEDEC J-STD-609 for lead finish identification. Additionally, the items require specialized ESD and EMI protective packaging per MIL-PRF-81705 and specific cushioning materials according to A-A-59136. Security and compliance mandates include CMMC Level 2 self-assessment, adherence to Covered Defense Information requirements, and the prohibition of intentionally added mercury.
Semiconductor and Related Device Manufacturing

POSTED

about 10 hours ago

DEADLINE

in 5 days
View Details

Earlier notices in this NAICS code

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