This Government Contract opportunity from Department Of Defense was posted on June 18, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Non-Traditional Hardware & Material Integration
Contract Overview
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AI Contract Overview
The contract seeks innovative prototype computing systems built on non-silicon substrates such as organic electronics, memristors, or repurposed consumer hardware, specifically designed for operation in austere environments where traditional silicon-based systems are impractical or unreliable. The focus is on integrating novel materials and architectures to deliver functional, resilient computing capabilities under extreme conditions, emphasizing adaptability, durability, and low resource requirements. This initiative aims to push the boundaries of hardware design by leveraging emerging technologies beyond conventional semiconductor approaches, fostering breakthroughs in field-deployable computational platforms. Submissions are expected to demonstrate feasible prototypes that align with the technical goals of advanced computing in constrained settings, with no set-aside type specified and the solicitation open under NAICS code 334418 for other computer equipment manufacturing. The opportunity is structured as a subcontract under the Defense Advanced Research Projects Agency, part of the Department of Defense, with a response deadline of July 17, 2026. While no specific location for performance or point of contact is listed, applicants must thoroughly address the technical challenges of material integration and environmental resilience to be considered for award.
General Info
Agency
NAICS
Place of Performance
VASet-Aside
Documents
This scope was carved out of DARPA-SN-26-97.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Request for Information: Low Resource Computing
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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