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PCB Fabrication and SMT Assembly

Active

Federal

Response Deadline12/10/2026, 10:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract involves the fabrication of multi-layer printed circuit boards and the execution of Surface Mount Technology assembly for prime contractors supporting US Air Force F-15 UDTMR Retrofit Kit projects. The scope of work includes producing either bare-board or populated Circuit Card Assemblies using electronic components specified in the Bill of Materials. Performance will take place in Warner Robins, Georgia, under the oversight of the Department of Defense. Strict adherence to industry quality and aerospace standards is required, including IPC-A-610 Class 2/3, J-STD-001, ISO 9001:2015, and AS9100D. Additionally, the contractor must maintain compliance with DFARS 252.246-7007 and AS5553. Interested parties must submit their responses by December 10, 2026.

General Info

Fabrication and SMT assembly of F-15 circuit boards in Georgia by December 2026.

Agency

Department Of Defense → FA8505 Aflcmc Waqkb

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

Warner Robins, GA, 31098, USA

Set-Aside

NONE

Documents

This scope was carved out of FA8505-27-UDTMR.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

F-15 Universal Serial Bus Data Transfer Module Reader (UDTMR) Retrofit Kits

AI Contract Breakdown

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Timeline

PostedOct 27

subcontract

Response DeadlineDec 10

Submission deadline

Response Deadline

12/10/2026, 10:00:00 PM UTCin about 1 month

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Organization & Contact Information

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AgencyDepartment Of Defense → FA8505 Aflcmc Waqkb

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → FA8505 Aflcmc Waqkb

Office AddressN/A

ContactsNo contact information available

Full Description

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Fabricates multi-layer printed circuit boards and performs Surface Mount Technology (SMT) assembly for prime contractors on US Air Force F-15 UDTMR Retrofit Kit projects. Executes SMT and multi-layer fabrication using BOM-specified electronic components. Requires IPC-A-610 Class 2/3, J-STD-001, ISO 9001:2015, AS9100D, and DFARS 252.246-7007/AS5553 compliance. Delivers populated or bare-board Circuit Card Assemblies (CCAs).

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