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PCB Fabrication for Auto Interface Unit

Active

Federal

Response Deadline09/29/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract involves the fabrication of raw, unpopulated printed circuit boards for an Auto Interface Unit supporting Department of Defense supply contracts. The scope of work includes board layout, etching, drilling, and plating using high-precision machinery and automotive-grade substrates, all while adhering to strict IPC fabrication standards. The project falls under NAICS code 334413 and is managed by the Construction and Equipment T & IFO EQ agency. Performance will take place at APO 96319-5014, with a response deadline set for September 29, 2026.

General Info

Subcontract for fabricating DoD Auto Interface Unit circuit boards by September 29, 2026.

Agency

Department Of Defense → CONSTRUCTION & EQUIPMENT T & IFO EQ

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

APO, AP, 96319-5014, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE8EN-26-T-1323.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

INTERFACE UNIT, AUTO

AI Contract Breakdown

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Timeline

PostedSep 24

subcontract

Response DeadlineSep 29

Submission deadline

Response Deadline

09/29/2026, 05:00:00 PM UTCin 4 days

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Organization & Contact Information

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AgencyDepartment Of Defense → CONSTRUCTION & EQUIPMENT T & IFO EQ

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → CONSTRUCTION & EQUIPMENT T & IFO EQ

Office AddressN/A

ContactsNo contact information available

Full Description

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Fabricates raw printed circuit boards for prime contractors delivering DLA supply contracts. Performs board layout, etching, drilling, and plating of the PCB using high-precision fabrication machinery and automotive-grade substrates. Adheres to IPC standards for PCB fabrication. Delivers unpopulated printed circuit boards.

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