Precision Die Bonder System Supply and Integration

The contract calls for the supply, installation, and commissioning of a high-accuracy die bonder specifically designed for advanced semiconductor packaging applications, requiring placement precision of five micrometers or better and integrated automated epoxy dispensing capabilities. This equipment must meet stringent performance benchmarks to support critical military and defense-grade semiconductor manufacturing processes. The work is to be performed at a facility with a zip code of 20375, which corresponds to the Naval Research Laboratory in Washington D.C., underscoring the defense-oriented nature of the project. The contract is structured as a subcontract under the Department of Defense and falls under NAICS code 333992, which covers other industrial machinery manufacturing. Proposals are due by August 7, 2026, with the opportunity posted on July 23, 2026, allowing potential vendors a three-week window to submit responses. The contracting activity is managed by the Naval Research Laboratory, and the system must be fully functional upon commissioning, including validation of accuracy, reliability, and integration with existing production workflows.