This Government Contract opportunity from National Aeronautics And Space Administration was posted on July 27, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Precision PCB Assembly (Class 3)
Contract Overview
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AI Contract Overview
The contract requires the precise assembly of one of six printed circuit boards using surface mount and through-hole technologies, adhering strictly to IPC Class 3 and J-STD-001 aerospace standards to ensure the highest levels of reliability and performance for mission-critical applications. The work must be performed to meet rigorous quality and documentation requirements expected in the aerospace industry, with no tolerance for defects that could compromise system integrity. The contract is classified as a subcontract under NAICS code 334419 and is being managed by the NASA Shared Services Center on behalf of the National Aeronautics and Space Administration. Solicitation documents were posted on July 27, 2026, with a firm response deadline of July 29, 2026, at 8:00 PM. The place of performance and point of contact details are not specified, but compliance with the technical standards and timely delivery are paramount. The contract does not designate a set-aside type, indicating it is open to general competition among qualified subcontractors.
General Info
Agency
NAICS
Place of Performance
MSSet-Aside
Documents
This scope was carved out of 80NSSC26939777Q.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
PCB FABRICATION AND ASSEMBLY OF HPSC PROCESSOR CARD
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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