This Government Contract opportunity from Department Of Defense was posted on April 21, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Printed Circuit Board (PCB) Fabrication
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
This contract involves the manufacture of bare multilayer printed circuit boards (PCBs) that meet military specifications, encompassing processes such as etching, drilling, plating, and finishing. The contractor is required to develop or obtain stable base master phototools to support the production process. The contract falls under the NAICS code 334418, which relates to the manufacturing of printed circuit boards. Issued by the Department of Defense through SPRMM1 DLA Mechanicsburg, this subcontract opportunity was posted on April 21, 2026, with a response deadline of May 18, 2026. The contract does not specify any set-aside type or particular location details for performance or contractor office. The focus is strictly on the fabrication of high-quality, military-grade multilayer PCBs in compliance with rigorous standards.
General Info
Place of Performance
PASet-Aside
Documents
This scope was carved out of SPRMM1-26-Q-KD73.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
59 - CIRCUIT CARD ASSEMB
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
More opportunities from Department Of Defense → SPRMM1 DLA Mechanicsburg
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