Qualified Semiconductor Device Assembly and Testing

The contract awards the full assembly and final testing of ten units of a critical semiconductor device identified by NSN 5961-01-185-2816 and Part No 16E1039-61, requiring sourcing from qualified suppliers and rigorous testing compliant with military standards. All work must be performed at the designated place of performance in New Cumberland, Pennsylvania, and the device must meet exacting defense-grade specifications to ensure reliability and performance in operational environments. The contract is structured as a subcontract under a Total Small Business Set-Aside, exclusively available to small businesses as defined by the SBA, with the NAICS code 334413 indicating the classification for semiconductor and related device manufacturing. The solicitation was posted on July 30, 2026, with a firm response deadline of August 10, 2026, and is administered by the Active Devices Division of the Department of Defense. Although specific point of contact details are not provided, prospective offerors must submit proposals through the official DIBBS platform via the provided UI link. The scope demands end-to-end accountability from component procurement through final test and certification, with adherence to defense quality and traceability requirements throughout the manufacturing lifecycle. All subcontractors must be prepared to demonstrate compliance with federal defense acquisition regulations and maintain full documentation to support inspection and audit readiness.