SEMICONDUCTOR DEVICE ASSEMBLY

This contract pertains to the procurement of 10 units of a semiconductor device identified by NSN 5961-01-185-2816 and part number 16E1039-61, designated as a critical application item requiring strict compliance with defense supply chain standards. The item must be sourced from qualified suppliers listed under the Qualified Suppliers List of Distributors and Qualified Testing Suppliers List for Federal Supply Class 5961 and 5962, and all suppliers must adhere to the qualification criteria outlined in Procurement Note M01. The contractor is required to implement full supply chain traceability documentation in accordance with DLA Directive Procurement Note C03, retain all related records, and ensure physical identification and marking of the bare items per specified military standards. Packaging must conform to MIL-STD-2073-1E and MIL-DTL-19491 for semiconductor devices, with labeling governed by MIL-STD-129 and IPC/JEDEC J-STD-609, which mandates precise marking of lead finish attributes on each unit package. The delivery is FOB origin, with inspection and acceptance occurring at destination, and the required delivery date is May 4, 2027, following a 266-day lead time. The item is subject to a zero percent quantity variance, and the contract is a total small business set-aside under NAICS code 334413, with procurement managed by the Department of Defense’s Active Devices Division. Shipments must be addressed to the DLA Distribution Facility in New Cumberland, Pennsylvania, and transportation logistics are governed by DLA Procurement Notes C19 and C20.