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This Government Contract opportunity from Department Of Defense was posted on April 23, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Raw Material & Wafer Supply Chain Integration

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

Active Opportunities Like This One

NAICS: 325998
New
DIBBS
POSTER
Solicitation # SPE7L5-26-T-5424
Solicitation SPE7L5-26-T-5424 is a fixed-price request for quotations issued by DLA Land and Maritime for the procurement of 275 posters, identified by NSN 7690-01-593-4698. The procurement falls under NAICS code 325998 and requires delivery within 71 days of award, with a need ship date of March 2, 2026, and an original required delivery date of January 7, 2027. All quotes must be submitted via the DLA Internet Bid Board System (DIBBS) by the deadline of September 21, 2026. The contract specifies that items must be delivered to the DLA Distribution DDSP New Cumberland facility in Pennsylvania. Inspection and acceptance will occur at the destination per FAR 52.246-1. Packaging must adhere to ASTM D3951 and RP001 for palletization, while marking and labeling must comply with MIL-STD-129, with the DLA Master List of Technical and Quality Requirements taking precedence. Payment and invoicing are to be processed electronically through the Wide Area WorkFlow (WAWF) system. Key regulatory requirements include compliance with the Buy American Act, the Berry Amendment, and DFARS 252.204-7012 regarding the safeguarding of covered defense information. The solicitation also incorporates various FAR and DFARS clauses concerning the prohibition of hexavalent chromium, combating trafficking in persons, and restrictions on mandatory arbitration agreements. This buy is identified as a potential candidate for automated award, provided there are no first article test requirements.
LAND SUPPLIER OPNS ENGINES

POSTED

2 days ago

DEADLINE

in 9 days
NAICS: 325998
New
DIBBS
FLUX, SOLDERING
Solicitation # SPE8E9-26-T-3767
Solicitation SPE8E9-26-T-3767 is a fixed-price request for quotations issued by DLA Troop Support, Construction and Equipment MRO SVC I, for the procurement of 310 quarts of soldering flux, identified by NSN 3439000098808. The requirement is under NAICS code 325998, with a delivery period of 59 days after order. Supplies are to be delivered FOB destination to DLA Distribution San Joaquin in Tracy, California. Inspection and acceptance will also occur at the destination. The material is classified as a hazardous flammable liquid (Hazard Class 3 UN1993, Packing Group II), requiring strict adherence to 49 CFR and ICAO/IMDG regulations for labeling and packaging. A current Material Safety Data Sheet must be provided electronically to DLA and accompany every shipment. Packaging must comply with MIL-PRF-23199E and MIL-STD-2073-IE, while marking must follow MIL-STD-129 and ISO/IEC 16388 for bar coding. Quality conformance is governed by RQ006, with sampling conducted per MIL-STD-1916 or ASO H1331. The solicitation includes a price evaluation preference for certified HUBZone small businesses. Offerors must comply with the Buy American Act and the Berry Amendment, providing full disclosure if non-domestic materials are used. Quotes must be submitted via DIBBS by September 21, 2026. Payment and receiving reports are to be processed electronically through the Wide Area Workflow system.
CONSTRUCTION & EQUIPMENT MRO SVC I

POSTED

2 days ago

DEADLINE

in 9 days
NAICS: 325998
New
DIBBS
LUBRICANT, TIRE AND RIM
Solicitation # SPE7L7-26-T-5204
Solicitation SPE7L7-26-T-5204 is a fixed-price request for quotations issued by DLA Land and Maritime for the procurement of 83 units of tire and rim lubricant (NSN 2640002565529). The requirement is managed under the First Destination Transportation program with a need ship date of March 9, 2027, and a required delivery date of March 14, 2027, to DLA Distribution San Joaquin in Tracy, California. Inspection and acceptance will occur at the destination. The contract mandates strict adherence to hazardous materials protocols, requiring the submission of Safety Data Sheets and hazard warning labels in accordance with 29 CFR 1910.1200 and Federal Standard No. 313-E. Packaging and marking must comply with MIL-STD-2073-1E and MIL-STD-129, while palletization must follow RP001. Notably, the use of Class I ozone-depleting chemicals and mercury compounds is prohibited. Quality assurance will be governed by MIL-STD-1916 or ASQ H1331, with a requirement for zero non-conformances in sample lots. Offerors must submit quotes via the DIBBS system and comply with the Buy American Act and Berry Amendment. The contract incorporates various FAR and DFARS clauses, including those regarding cybersecurity (DFARS 252.204-7012), sustainable products, and the prohibition of hexavalent chromium. Payment processing is to be handled electronically through the Wide Area WorkFlow system.
DLA DIST SAN JOAQUIN

POSTED

2 days ago

DEADLINE

in 9 days

AI Contract Overview

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The contract seeks to establish a secure and qualified domestic supply chain for critical raw materials including silicon wafers, dopants, and specialty gases required to sustain continuous manufacturing under MIL-PRF-19500 specifications. The work must be performed entirely within the United States to ensure compliance with national security requirements, with the place of performance located in Linda, California, 95652. The materials supplied must meet stringent defense-grade quality standards to support microelectronics production for critical military applications, and the subcontractor must demonstrate proven capability in sourcing, processing, and delivering these components reliably and without foreign dependency. This is a subcontract opportunity issued by the Defense Microelectronics Activity under the Department of Defense, with a solicitation posted on April 23, 2026, and responses due by May 14, 2026, at 9:00 PM Eastern Time. The North American Industry Classification System code 325998 indicates a focus on other chemical product and preparation manufacturing, aligning with the specialized nature of the required materials. Bidders must possess the technical expertise and infrastructure to maintain uninterrupted supply, ensure material traceability, and adhere to all defense-specific protocols for handling sensitive semiconductor feedstocks. Performance under this contract is essential to safeguarding the integrity and resilience of the U.S. military’s microelectronics supply base.

General Info

Establish domestic supply chain for critical raw materials ensuring reliable defense microelectronics production.

Agency

Department Of Defense → Defense Microelectronics ActivityView Agency

NAICS

325998 - All Other Miscellaneous Chemical Product and Preparation ManufacturingView NAICS

Place of Performance

LINDA, CA, 95652, USA

Set-Aside

NONE

Documents

This scope was carved out of HQ072726RNR03.

The full solicitation package (3 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Mitigating Obsolescence of MIL-PRF-19500

AI Contract Breakdown

Uniform Contract Format

No contract breakdown available.

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Microelectronics Activity
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Defense Microelectronics Activity
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

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Provide secure, qualified domestic supply of raw materials such as silicon wafers, dopants, and specialty gases for sustained MIL-PRF-19500 production.

More opportunities from Department Of Defense → Defense Microelectronics Activity

Same awarding agency

NAICS: 334417
SBIR / STTR
Cable Connector Enhancement
Solicitation # DME26TZ05-NP001
The Cable Connector Enhancement solicitation, numbered DME26TZ05-NP001 and issued by the Defense Microelectronics Activity under the Department of Defense, seeks an innovative and versatile solution to address failure-prone cable-to-board connections in electronics systems. Current methods, such as potting or Hot Bar Soldering, are often limited by mechanical constraints, high rework risks, or the need for assembly-specific tooling. The goal is to develop a more efficient method for maintaining reliable electrical connections in stressful environments, particularly for existing designs where full board redesigns are cost-prohibitive. This effort is structured as a Small Business Technology Transfer (STTR) program, set aside for total small businesses with fewer than 500 employees. The procurement process follows a trade-off basis, evaluating proposals based on technical merit, the qualifications of key personnel, and commercialization potential. Phase I typically lasts 6 to 12 months, with a potential transition to a 24-month Phase II. Proposals must be submitted via the Defense SBIR/STTR Internet Portal by September 23, 2026. Requirements include strict adherence to Cybersecurity Maturity Model Certification (CMMC) standards, full disclosure of foreign affiliations, and compliance with ITAR/EAR export controls. Awarded contracts will utilize Wide Area WorkFlow for invoicing and are subject to government inspection and acceptance at the destination.
Electronic Connector Manufacturing

POSTED

about 1 month ago

DEADLINE

in 11 days
View Details
NAICS: 334418
SBIR / STTR
Additive Manufacturing for Flexible Electronics
Solicitation # DME26BZ05-NV001
The Defense Microelectronics Activity, under the Department of Defense, is soliciting Phase I feasibility studies for additive manufacturing of flexible electronics to support high-mix, low-volume manufacturing. The objective is to validate 3D printing methods for electronics packaging and assembly, specifically targeting the development of prototypes comparable to Radio Frequency multichip modules. Key technical goals include achieving printed trace widths of 5 mil or better, supporting 12x12 BGA with 0.5mm ball pitch, and ensuring thermal resilience up to 150 degrees Celsius. The effort seeks to reduce costs and manufacturing timelines by utilizing vat photopolymerization, aerosol jet printing, and integrated printed passives while establishing reliability data based on MIL-STD quality metrics. This solicitation, numbered DME26BZ05-NV001, is a total small business set-aside under NAICS code 334418, with a response deadline of September 23, 2026. Proposals must be submitted via the Defense SBIR/STTR Innovation Portal and are evaluated based on technical merit, investigator qualifications, and commercialization potential using a trade-off process. Awardees must comply with strict cybersecurity requirements, including CMMC Level 2 certification and NIST SP 800-172 standards. The contract is structured as a fixed-price research and development effort, requiring detailed technical and cost volumes, full disclosure of foreign affiliations, and adherence to specific small business work-performance percentages.
Printed Circuit Assembly (Electronic Assembly) Manufacturing

POSTED

about 1 month ago

DEADLINE

in 11 days
View Details

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