Reactive Ion Etcher (ICP-RIE)

Texas A&M University has issued Invitation for Bid 28-EQUI-ITB-1653 for the procurement of a Plasma Therm / Corial 210IL Reactive Ion Etcher (ICP-RIE) system. The required equipment must be capable of interchanging between F-based and Cl-based etch chemistries to process materials such as Si, SiO2, SiN, metals, and III-V/II-VI compounds, including hard materials like Al2O3 and SiC. Key deliverables include the ICP-RIE system with a vacuum load-lock for 200mm substrates, three SEMI-standard wafer shuttles for 100mm, 150mm, and 200mm wafers, and a minimum 12-month warranty, with an option to bid for a total of two years. The solicitation follows a Best Value award basis, evaluating bidders on quality, delivery time, vendor experience, financial stability, and the ability to provide future maintenance. Bids must be submitted via the AggieBid portal by January 19, 2026. Delivery is required to College Station, TX, under FOB Destination or DDP terms, with payment terms set at Net 30. Vendors must comply with Executive Order GA-48 supplier certifications, disclose export control information including ITAR or ECCN classifications, and provide a Certificate of Insurance before commencing work.