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This Combined Synopsis/Solicitation opportunity from Department Of Defense was posted on July 8, 2020. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Ring Support Platform - Supply

Closed
W25G1VQ0182Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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General Info

NAICS

332710 - Machine Shops

Place of Performance

Tobyhanna, PA, 18466, USA

Set-Aside

SBA

Documents

3

Amendment+0001+Solicitation+W25G1V20Q0182.pdf

PDF

Attach+0001+Solicitation+W25G1V-20-Q-0182++Question+and+Answers+7-8-2020.pdf

PDF

W25G1V20Q0182++Ring+Support+Platform+RFQ.pdf

PDF

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Timeline

1 update
PhaseClosed
Posted

Combined Synopsis

Notice updated

The notice description changed.

Response Deadline

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Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → W0ML USA Deputy Tobyhanna
Contacts2 people available
OfficeTOBYHANNA, PA, 18466-5079, USA
Office AddressTOBYHANNA, PA, 18466-5079, USA

Full Description

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Tobyhanna Army Depot (TYAD) requires multiple steel Platform Rings to support refurbishment of two (2) NATO SEASPARROW Surface Missile System (NSSMS) Launchers. The award will be a Fixed Price IDIQ contract with three (3) Ordering Periods and a minimum and maximum quantity of the Platform Rings as detailed in the SOW. Drawings will be provided to vendors that provide proof of having a current and valid ITAR/ETAR registration on the Joint Certfication Program (JCP) only. Amendment 0001 W25G1V20Q0182 posted 7-8-2020 incorporates FAR Clause 52.225-2 Buy American; SOW Rev 1 which provides additional information on drawing D2362512 and provides Questions and Answers to this solicitation.

More opportunities from Department Of Defense → W0ML USA Deputy Tobyhanna

Same awarding agency

NAICS: 334413
Federal
Microelectronics Sourcing Capability for Tobyhanna Army Depot (RFI 2)
Solicitation # MicroelectronicsSourcingforTYAD2
The U.S. Army Contracting Command and Tobyhanna Army Depot are conducting market research through a Request for Information to identify qualified Original Component Manufacturers and Tier-1 direct distributors capable of supplying commercial-off-the-shelf, industrial, and defense-grade microelectronics. The primary goal is to move away from decentralized, broker-dependent procurement toward resilient, long-term direct relationships to support Circuit Card Assembly integration. The government is seeking partners who can sustain large-scale production volumes, ranging from hundreds of thousands to multi-million-unit annual runs, while maintaining vendor-managed inventory and the ability to handle rapid demand surges. To ensure supply chain integrity and anti-counterfeiting, the government requires strict provenance tracing from raw silicon and wafer fabrication through assembly and testing. Compliance with DoDI 5200.50, DFARS 252.246-7007/7008, and quality systems such as ISO 9001, AS9100, or IATF 16949 is essential, with AEC-Q200 qualification preferred for multilayer ceramic capacitors. Interested respondents must submit a capability package by October 27, 2026, detailing their corporate profile, supply tier classification, and manufacturing capacity. This RFI is for planning purposes only and does not constitute a formal solicitation or obligation for contract award.
Semiconductor and Related Device Manufacturing

POSTED

13 days ago

DEADLINE

in 6 days
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