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Robotics & Automation for Microelectronics Fabrication

Active

Federal

Response Deadline10/01/2029, 05:59:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This contract involves the development and deployment of advanced robotic systems and automation solutions tailored specifically for semiconductor manufacturing processes. The scope includes automation for wafer handling, process monitoring, and maintenance robotics, aimed at enhancing efficiency and precision in microelectronics fabrication. The project is managed as a subcontract under the Department of Energy and aligns with the NAICS code 333992, which covers industrial machinery manufacturing. The contract was posted on March 25, 2026, with a response deadline set for October 1, 2029, indicating a long-term opportunity for involvement in cutting-edge semiconductor manufacturing technologies. The place of performance is associated with the ZIP code 87123, which situates activities in a specific region, though further location details are not provided. This opportunity reflects a strategic initiative by the Department of Energy to advance manufacturing automation in critical technology sectors.

General Info

Develop advanced robotic automation for semiconductor manufacturing under Department of Energy subcontract.

Agency

Department Of EnergyView Agency

NAICS

333992 - Welding and Soldering Equipment ManufacturingView NAICS

Place of Performance

NM, 87123, USA

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

PostedMar 25

subcontract

Response DeadlineOct 1

Submission deadline

Response Deadline

10/01/2029, 05:59:00 AM UTCin about 3 years

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Organization & Contact Information

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AgencyDepartment Of Energy

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Energy

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Office AddressN/A

ContactsNo contact information available

Full Description

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Development and deployment of robotic systems and automation solutions for semiconductor manufacturing, including wafer handling, process monitoring, and maintenance robotics.

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