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Robotics & Automation for Microelectronics Fabrication

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This contract involves the development and deployment of advanced robotic systems and automation solutions tailored specifically for semiconductor manufacturing processes. The scope includes automation for wafer handling, process monitoring, and maintenance robotics, aimed at enhancing efficiency and precision in microelectronics fabrication. The project is managed as a subcontract under the Department of Energy and aligns with the NAICS code 333992, which covers industrial machinery manufacturing. The contract was posted on March 25, 2026, with a response deadline set for October 1, 2029, indicating a long-term opportunity for involvement in cutting-edge semiconductor manufacturing technologies. The place of performance is associated with the ZIP code 87123, which situates activities in a specific region, though further location details are not provided. This opportunity reflects a strategic initiative by the Department of Energy to advance manufacturing automation in critical technology sectors.

General Info

Develop advanced robotic automation for semiconductor manufacturing under Department of Energy subcontract.

Agency

Department Of EnergyView Agency

NAICS

333992 - Welding and Soldering Equipment ManufacturingView NAICS

Place of Performance

NM, 87123, USA

Set-Aside

NONE

Documents

This scope was carved out of 26_04.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Request for Information (RFI) for Advancing Critical and Emerging Microelectronics Technologies

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Timeline

Posted

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Response Deadline

Submission deadline

Response Deadline

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Organization & Contact Information

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AgencyDepartment Of Energy
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Energy
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Office AddressN/A
ContactsNo contact information available

Full Description

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Development and deployment of robotic systems and automation solutions for semiconductor manufacturing, including wafer handling, process monitoring, and maintenance robotics.

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ACTIVE DEVICES DIVISION

POSTED

1 day ago

DEADLINE

in 10 days
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