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AI-Enabled Microelectronics Manufacturing

Active

Federal

Response Deadline10/01/2029, 05:59:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This contract involves leveraging artificial intelligence and machine learning technologies to enhance semiconductor manufacturing processes. The key focus areas include predictive maintenance to reduce equipment downtime, improving yield rates through advanced data analysis, detecting manufacturing defects more effectively, and creating digital twin models to simulate and optimize production environments. The initiative aims to drive innovation in microelectronics manufacturing by implementing cutting-edge AI solutions to increase efficiency and product quality. Issued by the Department of Energy, this subcontract falls under the NAICS code 541715, which pertains to research and development in the physical, engineering, and life sciences. The contract is associated with a location corresponding to the 87123 ZIP code, though specific details on the place of performance or point of contact are not provided. The posted date is March 25, 2026, with responses due by October 1, 2029, indicating a long-term opportunity for collaboration in advancing semiconductor manufacturing techniques through AI-enabled technologies.

General Info

AI-driven semiconductor manufacturing contract focused on predictive maintenance, defect detection, and digital twins.

Agency

Department Of EnergyView Agency

NAICS

541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)View NAICS

Place of Performance

NM, 87123, USA

Set-Aside

NONE

Documents

This scope was carved out of 26_04.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Request for Information (RFI) for Advancing Critical and Emerging Microelectronics Technologies

AI Contract Breakdown

Uniform Contract Format

No contract breakdown available.

Cannot generate Contract Breakdown because no documents were found from this contract's source.

Timeline

PostedMar 25

subcontract

Response DeadlineOct 1

Submission deadline

Response Deadline

10/01/2029, 05:59:00 AM UTCin about 3 years

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Organization & Contact Information

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AgencyDepartment Of Energy

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Energy

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Office AddressN/A

ContactsNo contact information available

Full Description

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Application of artificial intelligence and machine learning to optimize semiconductor manufacturing processes, including predictive maintenance, yield enhancement, defect detection, and digital twin modeling.

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