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Advanced Semiconductor Device R&D

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This contract involves research and development focused on next-generation microelectronic devices, including analog and digital signal processors, power electronics, sensors, timing devices, and communication components. It is classified under the NAICS code 334413, which pertains to semiconductor and related device manufacturing. The Department of Energy is the awarding agency, and the work is set to be performed in the area designated by the zip code 87123. The contract is a subcontract opportunity titled "Advanced Semiconductor Device R&D" with a response deadline set for October 1, 2029. While the solicitation number and specific organization types are not provided, the contract emphasizes cutting-edge innovation in semiconductor technology components critical to various electronic applications. Additional details such as the point of contact, exact location, or any set-aside status are not specified.

General Info

Subcontract for advanced semiconductor device R&D awarded by Department of Energy, deadline October 1, 2029.

Agency

Department Of EnergyView Agency

NAICS

334413 - Semiconductor and Related Device ManufacturingView NAICS

Place of Performance

NM, 87123, USA

Set-Aside

NONE

Documents

This scope was carved out of 26_04.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Request for Information (RFI) for Advancing Critical and Emerging Microelectronics Technologies

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Energy
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Energy
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Office AddressN/A
ContactsNo contact information available

Full Description

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Research and development of next-generation microelectronic devices including analog/digital signal processors, power electronics, sensors, timing devices, and communication components.

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