This Government Contract opportunity from Department Of Defense was posted on April 22, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Ruggedized Motherboard and Component Manufacturing

Closed

Federal

Submission Closed06/30/2026, 08:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334418

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AI Contract Overview

This contract involves the manufacture and supply of ruggedized motherboards and related subsystems designed to comply with stringent military standards, specifically MIL-STD-810G and MIL-STD-901D, which address shock, vibration, temperature, and humidity endurance. These conformal-coated components are intended for use in demanding environments, ensuring durability and reliability in critical applications. A key requirement is the exclusion of any components originating from China, emphasizing security and supply chain integrity. The contract is categorized as a subcontract under NAICS code 334418 and is issued by the Department of Defense, with the place of performance specified as Redstone Arsenal. The solicitation was posted on April 22, 2026, with a response deadline set for June 30, 2026. This opportunity targets manufacturers capable of delivering high-quality, military-grade electronic assemblies that meet rigorous environmental and operational criteria.

General Info

Manufacture ruggedized motherboards meeting MIL-STD-810G/901D; no Chinese components; DoD subcontract.

Agency

Department Of Defense → W6QK Acc-rsaView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

Redstone Arsenal, AL, 35898, USA

Set-Aside

NONE

Documents

This scope was carved out of SCH-26-01.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Specialized Computer Hardware, for Portfolio Capability Executive (PAE) Fires

AI Contract Breakdown

Uniform Contract Format

No contract breakdown available.

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Timeline

PhaseClosed

PostedApr 22

subcontract

Response DeadlineJun 30

Deadline has passed

Submission Closed

06/30/2026, 08:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → W6QK Acc-rsa

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → W6QK Acc-rsa

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

Manufacture and supply conformal-coated motherboards and subsystems that meet MIL-STD-810G and MIL-STD-901D for shock, vibration, temperature, and humidity. Must exclude Chinese-origin components.