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This Subcontract opportunity from Department Of Defense was posted on January 16, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Scalable Manufacturing Pathway Development

Closed
Federal

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The Scalable Manufacturing Pathway Development subcontract, issued by the Defense Advanced Research Projects Agency under the Department of Defense, focuses on creating a scalable integration strategy for novel heterostructures. The primary objectives include the design of process flows, the development of yield modeling, and a comprehensive assessment of compatibility with existing CMOS fabrication facilities. This opportunity was posted on January 16, 2026, with a response deadline of January 27, 2026. Classified under NAICS code 333242, the project aims to bridge the gap between novel material structures and large-scale industrial manufacturing capabilities.

General Info

NAICS

333242 - Semiconductor Machinery Manufacturing

Place of Performance

VA

Set-Aside

NONE

Documents

This scope was carved out of DARPA-SN-26-31.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Advanced Research Projects Agcy
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Development of a scalable integration strategy for novel heterostructures, including process flow design, yield modeling, and compatibility assessment with existing CMOS fabs.

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