Semi-Automatic Die Bonder Station-NOTICE TO SOLE SOURCE

The National Institute of Standards and Technology (NIST) Acquisition Management Division intends to negotiate with Tresky Corporation located in Morganville, NJ on a sole source basis under the authority of FAR Subpart 13.106-1(b), soliciting from a single source, for a semi-automatic die bender station. Specific Requirements are attached. This shall be provided and accomplished in accordance with these specifications. NAICS Code is 334413 - Semiconductor and Related Device Manufacturing, with a Size Standard of 1,250 employees. NIST anticipates negotiating and awarding a firm-fixed-price purchase order to Tresky Corporation Photonics for this requirement. Interested parties that can demonstrate they could satisfy the requirement listed above for NIST must clearly and unambiguously identify their capability to do so in writing on or before the response date for this notice. This notice of intent is not a solicitation. Information submitted in response to this notice will be used solely to determine whether competitive procedures could be used for this acquisition. If competitive procedures are not used it is estimated that an award will be issued 4th Quarter of FY23. Any questions regarding this notice must be submitted in writing via email to contact@example.gov . All responses to this notice of intent must be submitted to contact@example.gov no later than the date and time provided herein this posting. JUSTIFICATION FOR OTHER THAN FULL AN OPEN COMPETITION: Market research resulted in Tresky Corporation being the only vendor to provide a commercial semi-automatic die bender station. The Quantum Sensors Group (QSG) (687.08) within the Quantum Electromagnetics Division maintains a facility to support the production of state-of-the-art detector focal plane modules. These modules are utilized in NIST internal and outside agency funded instruments. This facility consists of a 400 sq-ft cleanroom with multiple machines and equipment including microscopes, multiple manual wire bonders, an automatic wire bonder, a probe station, robotic epoxy dispenser, and manual die bonders. The QSG has multiple new programs which will require the placement of components precisely with controlled heat and force versus time profiles. For these tasks, the QSG requires a Semi-Automatic Die Bonder Station. The Semi-Automatic Bonding Station will be purchased under 41 USC 3304(a)(1) - "Only one responsible source" Pursuant to FAR 13.106. DESCRIPTION OF REQUIREMENT: The QSG has a number of new tasks and programs that require a Semi-Automatic Bonding Station that can both attach mm sized objects to 20 mm sized chips and then place these chips into larger modules that may be up to 300 mm by 250 mm. Both of these tasks require micron level placement. The mm sized objects require high force (>40 kg-F) and heat (up to 40kg-F). For that reason, and due to lab space constraints, QSG require a bonding station that can accept a wide range of part size, has micron level placement and high force/heat that is compact in overall size. WHY IT IS SOLE SOURCE: If the Government did not purchase the Tresky T-3000-PRO, there could be a range of undesirable outcomes. If the work holder is too small, the range of parts QSG could use would be limited and QSG would need to procure a second machine. If the machine can not apply high force/heat, QSG again would be forced to acquire a second machine for a large fraction of the required tasks. QSG don't currently have enough lab space for a second machine or a machine which is larger in overall size. If the placement accuracy was not sufficient, QSG would need to redesign our chips and modules with an expected degraded performance. These outcomes would not be best value to the Government. MARKET RESEARCH: The QSG is expanding its detector module assembly capabilities and requires a Semi-Automatic Die Bonder Station that can accommodate both modules that may be up to 300 mm by 250 mm with 10-20 mm sized chips while also accommodating the attachment of 1mm sized Sn pieces to 20 by 20 mm arrays that requires high force and heat. After market research, QSG were only able to determine that the offering form Tresky Corp. will meet our requirements . As part of the market research, QSG contacted several vendors for which their offering does not meet the maximum force, heating, and module thickness requirements. Additionally, their offering does not have an ultrasound upgrade available, or their offering does not meet the module lateral extent and thickness requirements. With this market research QSG have identified only the Tresky Corp for this requirement.