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This Government Contract opportunity from Department Of Defense was posted on August 26, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Semiconductor/Active Device Manufacturing

Closed
Federal

Contract Overview

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This subcontract for Semiconductor/Active Device Manufacturing involves the production of active electronic devices for prime contractors supporting the Department of Defense Active Devices Division. The manufacturer must fabricate components according to the DLA Master List of Technical and Quality Requirements and ensure lead finish markings adhere to IPC/JEDEC J-STD-609 standards. To meet these specifications, the provider is required to maintain cleanroom fabrication facilities and utilize precision marking equipment. The contract mandates strict compliance with the DLA Counterfeit Detection and Avoidance Program to ensure the integrity of all delivered finished active electronic components. Performance for this project is based in Columbus, Ohio, under NAICS code 334413. The solicitation was posted on August 26, 2026, with a response deadline of September 8, 2026.

General Info

Subcontract for DoD active electronic device manufacturing in Columbus, Ohio, under NAICS 334413.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-446C.

The full solicitation package (3 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, DIGITA

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Manufactures active electronic devices for prime contractors on DLA Land and Maritime Active Devices Division projects. Fabricates devices per the DLA Master List of Technical and Quality Requirements and applies lead finish markings per IPC/JEDEC J-STD-609 paragraphs 5.3.1 and 5.3.2. Requires cleanroom fabrication facilities and precision marking equipment. Complies with DLA Counterfeit Detection and Avoidance Program (CDAP). Delivers finished active electronic components.

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