This Government Contract opportunity from Department Of Defense was posted on August 26, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Semiconductor Device Manufacturing & Testing

Closed

Federal

Submission Closed08/28/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334413

New

DIBBS

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Supplier of Semiconductor Device, Diode (NSN 5961-01-026-2577)This subcontract, issued by the Department of Defense DLA Weapons Support Active Devices Division, requires the supply of two semiconductor diode units under NSN 5961-01-026-2577. The hardware must be delivered to Tobyhanna, Pennsylvania, and the supplier is required to hold qualifications for FSC 5961 and 5962. Strict adherence to military standards is mandatory, including packaging per MIL-STD-2073-1E and MIL-DTL-19491, and marking per MIL-STD-129 and IPC/JEDEC J-STD-609. Additionally, the provider must maintain full supply chain traceability in accordance with DLAD Procurement Note C03. The response deadline for this requirement is November 9, 2026.

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Supply of Fixed Wire Wound Resistors (NSN 5905-01-063-8462)This subcontract involves the supply of 5,000 fixed wire wound resistors for prime contractors supporting DLA supply contracts. The components must be manufactured or sourced to meet NSN 5905-01-063-8462 specifications. All items require strict adherence to marking standards MIL-STD-129 and IPC/JEDEC J-STD-609, with packaging performed according to MIL-STD-2073-1E and RP001. The contract is managed by the Department of Defense under the DLA Weapons Support Active Devices Division, with performance taking place at Hill AFB. Compliance with the Buy American Act and DFARS 252.204-7012 is mandatory. The response deadline for this requirement is November 9, 2026.

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Supply of Flashlights (NSN 6230014688129)This subcontract involves the procurement or manufacture of 457 flashlights for prime contractors supporting the DLA Weapons Support Nuclear Reactor Program under the Department of Defense. All units must strictly adhere to the technical specifications for NSN 6230014688129, with detailed technical data accessible via the DLA portal. The contractor is responsible for packaging the items according to MIL-STD-2073-1E standards and shipping them FOB Origin to the place of performance in Tracy, California. The opportunity is categorized under NAICS code 334413, with a response deadline set for November 9, 2026.

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Supply of Digital Microcircuits (NSN 5962-01-067-9523)This subcontract, issued by the DLA Weapons Support Active Devices Division of the Department of Defense, requires the supply of 115 digital microcircuits under NSN 5962-01-067-9523. The components must adhere to IPC/JEDEC J-STD-609 lead finish identification standards and be delivered with DLA Form 918 traceability documentation. To ensure component integrity, the contractor must utilize DOD qualified ESD/EMI protective packaging in accordance with MIL-PRF-81705, MIL-STD-2073-1E, and MIL-STD-129. The opportunity is designated as a Total Small Business Set-Aside under NAICS code 334413, with performance taking place in Columbus, Ohio. Prospective bidders are required to provide a CMMC Level 2 self-assessment. The solicitation was posted on October 28, 2026, with a response deadline of November 9, 2026.

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Supply of Fixed Film Resistor Networks (NSN 5905-01-332-2602)

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Supply of Waveguide Horn Covers (NSN 5985-00-545-4790)This subcontract involves the manufacture or procurement of seven waveguide horn covers, identified by NSN 5985-00-545-4790, for prime contractors supporting the Defense Logistics Agency Weapons Support Maritime Supply Chain. The selected provider must ensure all units are marked according to MIL-STD-129 and packaged in strict compliance with DLA requirement RP001. The contract falls under NAICS code 334413 and mandates rigorous security and data handling standards, specifically requiring CMMC Level 2 and DFARS 252.204-7012 compliance. Interested parties must submit their responses by November 9, 2026.

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Supplier of Memory Microcircuits (NSN 5962-01-567-9623)This subcontract involves the supply of eight memory microcircuits, specifically NSN 5962-01-567-9623, to prime contractors supporting the DLA Weapons Support Active Devices Division. The selected supplier is responsible for manufacturing or sourcing these components using cleanroom facilities and ESD-protected handling. Strict adherence to technical standards is required, including IPC/JEDEC J-STD-609 for lead finish markings and MIL-STD-2073-1E and MIL-STD-129 for packaging. The contract mandates compliance with the Buy American Act and DFARS cybersecurity regulations. Deliveries must be accompanied by DLA Form 918 and full traceability documentation. Performance for this requirement is centered in Columbus, Ohio, under NAICS code 334413, with a response deadline of November 9, 2026.

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Supply of Push Switches (NSN 5930-01-062-4904)This subcontract involves the supply of push switches identified by NSN 5930-01-062-4904 for prime contractors supporting the Department of Defense DLA Weapons Support Maritime Supply Chain. The selected source or manufacturer must provide one unit of the specified switch, ensuring compliance with RP001 packaging requirements and strict mercury-free material restrictions. The use of approved additive manufacturing processes is permitted to meet the technical specifications. The opportunity is categorized under NAICS code 334413 and was posted on October 28, 2026, with a response deadline of November 9, 2026. All deliverables must be packaged according to DLA specifications to ensure successful integration into the maritime supply chain.

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Supply of Sealed Lead Acid Battery Type I (NSN 6130016325119)This subcontract through the Defense Logistics Agency involves the supply of two Sealed Lead Acid Battery Type I power supply units for the USS BILLINGS (LCS-15). The hardware must strictly adhere to NSN 6130016325119 specifications and carries a non-extendable shelf life of 12 months. Compliance requirements include adherence to the Buy American Act and Berry Amendment, as well as MIL-STD-129 for marking and MIL-STD-2073-1E for packaging. Additionally, the provider must maintain CMMC Level 2 certification and follow MIL-STD-1916 sampling standards. The response deadline for this requirement is November 9, 2026.

Defense Logistics Agency

POSTED

about 5 hours ago

DEADLINE

in 12 days

AI Contract Overview

The Department of Defense Active Devices Division is seeking a subcontractor for the full lifecycle manufacturing, testing, and quality assurance of a semiconductor device. This project encompasses the entire production process, including wafer fabrication, packaging, and environmental stress screening, all of which must adhere to strict military standards. The contract is categorized under NAICS code 334413 and will be performed in New Cumberland, Pennsylvania. Interested parties must respond by August 28, 2026, following the posting date of August 26, 2026.

General Info

DoD seeks subcontractor for semiconductor manufacturing and testing in New Cumberland, PA.

Agency

Department Of Defense → ACTIVE DEVICES DIVISION

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

NEW CUMBERLAND, PA, 17070-5002, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-381S.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SEMICONDUCTOR DEVIC

AI Contract Breakdown

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Timeline

PhaseClosed

PostedAug 26

subcontract

Response DeadlineAug 28

Deadline has passed

Submission Closed

08/28/2026, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

Office AddressN/A

ContactsNo contact information available

Full Description

Full lifecycle manufacturing, testing, and quality assurance of a semiconductor device per military standards including wafer fabrication, packaging, and environmental stress screening.