SEMICONDUCTOR DEVIC

SEMICONDUCTOR DEVIC
SEMICONDUCTOR DEVIC
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL INDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
SPE7M5-26-T-381S
SECTION B
The Government Procuring Activity has determined that Surplus is not Acceptable for this NSN. (End of TQ Requirement)
RD003, COVERED DEFENSE INFORMATION POTENTIALLY APPLIES
CENTRAL COMPONENTS, INC. 1NV69 P/N CMDSH-3 LEAD FREE
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7017775808 0001 EA 589.000
NSN/MATERIAL:5961016505331
DELIVERY (IN DAYS):0168
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:41 CLNG/DRY:1 PRESV MAT:00
WRAP MAT:00 CUSH/DUNN MAT:NA CUSH/DUNN THKNESS:B
UNIT CONT:A2 OPI:M
INTRMDTE CONT:D3 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:00 -00 No special marking
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
SPE7M5-26-T-381S
SECTION B
PR: 7017775808 PRLI: 0001 CONT’D
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS
PARCEL POST ADDRESS:
W25G1U
W1A8 DLA DISTRIBUTION
DDSP NEW CUMBERLAND FACILITY
2083 NORMANDY DRIVE DOOR 113 TO 134
NEW CUMBERLAND PA 17070-5002
US
FOR TRANSPORTATION SEE DLAD DLAD PROC NOTE C19. FOR FIRST DESTINATION TRANSPORTATION SEE DLAD PROC NOTE
C20 AND CONTRACT
FREIGHT SHIPPING ADDRESS:
W25G1U
W1A8 DLA DISTRIBUTION
DDSP NEW CUMBERLAND FACILITY
2083 NORMANDY DRIVE DOOR 113 TO 134
NEW CUMBERLAND PA 17070-5002
US
Need Ship Date:02/02/2027 Original Required Delivery Date:03/24/2027
SPE7M5-26-T-381S NSN/Part Number: 5961-01-650-5331 Quantity: 589 EA Purchase Request: 7017775808QTY: 589 Delivery: 168 days ADO