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This Solicitation opportunity from Department Of Defense was posted on May 22, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

SEMICONDUCTOR DEVIC

Closed
SPE7M8-26-T-3725Federal

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This contract covers the procurement of 59 units of a specific semiconductor device, identified by NSN 5961-01-307-5349, with a required delivery period of 315 days and shipment originating from the contractor’s location to DLA Distribution at Robins Air Force Base, Georgia. The item must comply with a range of technical and quality requirements as outlined in the DLA Master List of Technical and Quality Requirements in effect at the solicitation or award date. The semiconductor device's packaging and handling must meet strict military standards for electrostatic discharge (ESD) and electromagnetic interference (EMI) protection in accordance with MIL-PRF-81705, including requirements for cushioning and barrier materials to prevent damage to leads and components during transit and storage. Marking and labeling of the items must follow IPC/JEDEC J-STD-609 standards for identifying lead finish attributes such as Pb and Pb-free status. The contract mandates rigorous supply chain traceability documentation retained by the contractor and adherence to qualified suppliers lists for obtaining these classified electronic components. Inspection and acceptance will occur at the destination, and packaging must conform to MIL-STD-2073-1E and MIL-STD-129 requirements, with specific attention to handling and marking consistent with DLA packaging guidelines. The purchase request number is 7014264797, with a designated point of contact at DLA for any queries. Overall, the contract ensures the delivery of military-grade semiconductor devices with precise specifications, quality assurance controls, and protective packaging to maintain component integrity throughout the supply chain.

General Info

Procurement of 59 military-grade semiconductors, delivered in 315 days with strict packaging and quality controls.

Agency

Department Of Defense → ELECTRICAL DEVICES DIV

NAICS

334413 - Semiconductor and Related Device Manufacturing View NAICS

Place of Performance

BLDG 376, ROBINS A F B, GA, 31098-1887, US

Set-Aside

NONE

Documents

(1)

RFQ SPE7M8-26-T-3725 for Electrical Devices

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Timeline

PhaseClosed
Posted

Solicitation

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → ELECTRICAL DEVICES DIV
Contacts1 person available
OfficeUS
Organization / Agency
Department Of Defense → ELECTRICAL DEVICES DIV
Office AddressUS

Full Description

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SEMICONDUCTOR DEVIC
SEMICONDUCTOR DEVICE
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL INDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
THE TECHNICAL DATA CITED IN THIS SOLICITATION IS NOT COMPLETE, HOWEVER, THE ITEM PROVIDED MUST MEET THE REQUIREMENTS OF THE CITED TECHNICAL DATA IN ADDITION TO THE REQUIREMENTS OF THE PART NUMBERED ITEM LISTED ON THIS SOLICITATION.
RAYTHEON CO ESD LONG ISLAND DIV 24587 P/N 04ES055-1 RAYTHEON COMPANY 3B150 P/N 99162309 RAYTHEON COMPANY 54X10 P/N 99162309
IAW REFERENCE DRAWING NR 24587 04ES055 REVISION NR J DTD 03/25/1994 PART PIECE NUMBER:
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments%
SPE7M8-26-T-3725
SECTION B
PR: 7014264797 PRLI: 0001 CONT’D
2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7014264797 0001 EA 59.000
NSN/MATERIAL:5961013075349
DELIVERY (IN DAYS):0315
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:GX CLNG/DRY:1 PRESV MAT:00
WRAP MAT:K3 CUSH/DUNN MAT:P4 CUSH/DUNN THKNESS:A
UNIT CONT:B9 OPI:M
INTRMDTE CONT:E5 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:39 -39 ESD sensitiv electrnic dvce
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
ESD and PHYSICAL protection are required for contacts, leads, terminals, and other protrusions by means of container design, cushioning, and/or other ESD protective devices. Components with pins or leads shall have adequate cushioning to PREVENT DAMAGE, BREAKAGE and/or BENDING OF LEADS when not specified in the packaging codes.
This item requires DOD QUALIFIED Electrostatic Discharge (ESD) and/or Electromagnetic Interference (EMI) protective packaging materials in accordance with MIL-PRF-81705. All items subject to degradation from ESD/EMI environmental field forces shall be handled and packaged at an approved field force protective work station.
For ESD protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used along with MIL-PRF-81705, Type III (MIL-DTL-117 Type II, Class H, Style 2) barrier material wrap if the contract doesn't specifically require ESD approved cushioning.
SPE7M8-26-T-3725
SECTION B
PR: 7014264797 PRLI: 0001 CONT’D
For EMI protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used.
The supplier shall be responsible for verifying that all MIL-PRF-81705 barrier materials (or converted bags) were supplied from a qualified manufacturer currently listed on QPL-81705.
For additional ESD/EMI packaging information, refer to the following DLA packaging website: https://www.dla.mil/HQ/LogisticsOperations/Packaging/PackFAQs/ESDS/
If the preservation method code in the solicitation does not specify ESD/EMI protection and the Offeror's proposed item of supply is subject to degradation from ESD/EMI environmental field forces, Offerors shall provide appropriate technical packaging data with their proposals.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
ESD and PHYSICAL protection are required for contacts, leads, terminals, and other protrusions by means of container design, cushioning, and/or other ESD protective devices. Components with pins or leads shall have adequate cushioning to PREVENT DAMAGE, BREAKAGE and/or BENDING OF LEADS when not specified in the packaging codes.
This item requires DOD QUALIFIED Electrostatic Discharge (ESD) and/or Electromagnetic Interference (EMI) protective packaging materials in accordance with MIL-PRF-81705. All items subject to degradation from ESD/EMI environmental field forces shall be handled and packaged at an approved field force protective work station.
For ESD protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used along with MIL-PRF-81705, Type III (MIL-DTL-117 Type II, Class H, Style 2) barrier material wrap if the contract doesn't specifically require ESD approved cushioning.
For EMI protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used.
The supplier shall be responsible for verifying that all MIL-PRF-81705 barrier materials (or converted bags) were supplied from a qualified manufacturer currently listed on QPL-81705.
For additional ESD/EMI packaging information, refer to the following DLA packaging website: https://www.dla.mil/HQ/LogisticsOperations/Packaging/PackFAQs/ESDS/
SPE7M8-26-T-3725
SECTION B
PR: 7014264797 PRLI: 0001 CONT’D
If the preservation method code in the solicitation does not specify ESD/EMI protection and the Offeror's proposed item of supply is subject to degradation from ESD/EMI environmental field forces, Offerors shall provide appropriate technical packaging data with their proposals.
PARCEL POST ADDRESS:
SW3119
DLA DISTRIBUTION WARNER ROBINS
455 BYRON STREET
BLDG 376
ROBINS A F B GA 31098-1887
US
FOR TRANSPORTATION SEE DLAD DLAD PROC NOTE C19. FOR FIRST DESTINATION TRANSPORTATION SEE DLAD PROC NOTE
C20 AND CONTRACT
FREIGHT SHIPPING ADDRESS:
SW3119
DLA DISTRIBUTION WARNER ROBINS
455 BYRON STREET BLDG 376
ROBINS A F B GA 31098-1887
US
Need Ship Date:04/21/2026 Original Required Delivery Date:04/26/2027
SPE7M8-26-T-3725 NSN/Part Number: 5961-01-307-5349 Quantity: 59 EA Purchase Request: 7014264797QTY: 59 Delivery: 315 days ADO