Semiconductor Component Manufacturing and Assembly

The contract entails the manufacturing and assembly of semiconductor components under stringent defense supply chain protocols, requiring strict adherence to International Traffic in Arms Regulations, Controlled Unclassified Information standards, and hazardous materials handling procedures. All work must be performed at the designated facility in Portsmouth, Virginia, with full compliance to Department of Defense security and operational requirements. The subcontract is issued under NAICS code 334416, indicating a focus on semiconductor and related device manufacturing, and is subject to the heightened scrutiny and documentation typical of defense-grade production. Proposals must be submitted by the deadline of July 24, 2026, with the solicitation posted on July 13, 2026. The contracting entity, MARITIME SUPPLY CHAIN ESOC BUYS, operates under the Department of Defense, emphasizing the critical national security nature of the components to be produced. While no set-aside provisions are specified, the work demands certified personnel, secure facility controls, and documented chain-of-custody procedures for all materials and finished products. All subcontractors must demonstrate proven capability in handling sensitive defense electronics and maintaining compliance with federal export control and information security mandates.