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This Government Contract opportunity from Department Of Defense was posted on July 23, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Semiconductor Component Supply (Memory & Digital Microcircuits)

Closed
Federal

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The contract seeks the supply of eight units of memory and digital microcircuits compliant with MIL-STD specifications, ensuring rigorous performance and reliability standards for defense applications. Full traceability throughout the manufacturing and delivery process is required, along with comprehensive test reporting to verify conformance and functionality. All components must be packaged and labeled in accordance with ESD-safe protocols to prevent electrostatic damage during handling and transit. The procurement is structured as a subcontract under the NAICS code 334413, targeting semiconductor component manufacturing, and is managed by the Active Devices Division of the Department of Defense. Performance is expected to be delivered to Columbus, Ohio, with a response deadline of August 3, 2026, and the solicitation was posted on July 23, 2026.

General Info

Supply eight MIL-STD memory and microcircuits with traceability, ESD packaging, test reports, delivery to Columbus, Ohio by August 3, 2026.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-350F.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, MEMORY

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Supply of 8 units of MIL-STD-compliant memory and digital microcircuits with full traceability, test reporting, and proper ESD-safe packaging and labeling.

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Keith Deutsch
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