SEMICONDUCTOR DEVIC

SEMICONDUCTOR DEVIC
SEMICONDUCTOR DEVICE ASSY.
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RD002, COVERED DEFENSE INFORMATION APPLIES
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ001: TAILORED HIGHER LEVEL CONTRACT QUALITY REQUIREMENTS
(MANUFACTURERS AND NON-MANUFACTURERS)
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ017: PHYSICAL IDENTIFICATION/BARE ITEM MARKING
Item Unique Identification is not required by request of the Service customer. DFARS 252.211-7003(c)(1)(i) applies.
RQ042: Non-Tailored Higher-Level Quality Requirements (ISO 9001:2015) for Manufacturers and Non-Manufacturers
THIS MATERIAL DOES NOT HAVE A SHELF LIFE REQUIREMENT
SAMPLING:
THE SAMPLING METHOD SHALL BE IN ACCORDANCE WITH MIL-STD-1916 OR ASQ
H1331, TABLE 1 OR A COMPARABLE ZERO BASED SAMPLING PLAN UNLESS OTHERWISE
SPECIFIED BY THE CONTRACT. IF THE APPLICABLE DRAWING, SPECIFICATION,
STANDARD, OR QUALITY ASSURANCE PROVISION (QAP) SPECIFIES CRITICAL, MAJOR
AND/OR MINOR ATTRIBUTES, THEY SHALL BE ASSIGNED VERIFICAITON LEVELS OF
VII, IV AND II OR AQLS OF 0.1, 1.0 AND 4.0 RESPECTIVELY. UNSPECIFIED
ATTRIBUTES SHALL BE CONSIDERED AS MAJOR UNLESS SAMPLING PLANS ARE
SPECIFIED IN APPLICABLE DOCUMENTS. FOR MIL-STD-1916, THE MANUFACTURER
MAY USE THE ATTRIBUTE OR VARIABLE INSPECTION METHOD AT THEIR OPTION OR
PER THE CONTRACT. MIL-STD-105/ASQ Z1.4 MAY BE USED TO SET SAMPLE LOT
SIZE, BUT ACCEPTANCE WOULD BE ZERO NON-CONFORMANCES IN THE SAMPLE LOT
UNLESS OTHERWISE SPECIFIED IN THE CONTRACT.
RD004: Cybersecurity Maturity Model Certification (CMMC) Level 2 Self-Assessment RD004: Cybersecurity Maturity Model Certification (CMMC) Level 2 Self-Assessment
THE BOEING COMPANY 77272 P/N 724E2401-10
SPE4A5-27-T-0282
SECTION B
PR: 7018605489 PRLI: 0001 CONT’D
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7018605489 0001 EA 1.000
NSN/MATERIAL:5961015937053
DELIVERY (IN DAYS):0020
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:41 CLNG/DRY:1 PRESV MAT:00
WRAP MAT:00 CUSH/DUNN MAT:NA CUSH/DUNN THKNESS:F
UNIT CONT:D3 OPI:M
INTRMDTE CONT:DO INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:00 -00 No special marking
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
BULK BREAK POINT:
SPE4A5-27-T-0282
SECTION B
PR: 7018605489 PRLI: 0001 CONT’D
W25KYQ
W7NX USPFO ACTIVITY PA ARNG
BLDG 1426 FIRE LANE AWCF SSF
FT INDIANTOWN GAP FTIG
ANNVILLE PA 17003-5003
US
SHIP BY TRACEABLE MEANS. DO NOT USE PARCEL POST.
FREIGHT SHIPPING ADDRESS:
W81PNF
W8QX PA ARNG AASF 1
BUILDING 19 101 BOAS ROAD
FT INDIANTOWN GAP
ANNVILLE PA 17003-5003
US
MARKFOR
W81PNF
W8QX PA ARNG AASF 1
BUILDING 19 101 BOAS ROAD
FT INDIANTOWN GAP
ANNVILLE PA 17003-5003
US
M/F: (TCN) W81PNF52090002
RDD: 210
PROJ: TP 3
SUPP ADD: W90E3H SIG: A
FOR GOVERNMENT USE ONLY: (IPD) 13
DIC: A3A DIST: ADV: FC: KS
Need Ship Date:00/00/0000 Original Required Delivery Date:07/31/2025
SPE4A5-27-T-0282 NSN/Part Number: 5961-01-593-7053 Quantity: 1 EA Purchase Request: 7018605489QTY: 1 Delivery: 20 days ADO