This Solicitation opportunity from Department Of Defense was posted on May 28, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
SEMICONDUCTOR DEVIC
Closed
SPE7M5-26-T-160SFederalSubmission Closed
Contract Overview
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General Info
Agency
Department Of Defense → ACTIVE DEVICES DIVISIONView Agency
NAICS
334413 - Semiconductor and Related Device ManufacturingView NAICS
Place of Performance
7537 WARDLEIGH RD, HILL AFB, UT, 84056-5734, USASet-Aside
NONE
Documents
(1)AI Contract Breakdown
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Timeline
PhaseClosed
Submission Closed
Organization & Contact Information
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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
Contacts1 person available
OfficeUSA
Office AddressUSA
Contacts
Full Description
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SEMICONDUCTOR DEVIC
DIODE VOLTAGE REGULATOR SILICON
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL INDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
SPE7M5-26-T-160S
SECTION B
The Government Procuring Activity has determined that Surplus is not Acceptable for this NSN. (End of TQ Requirement)
THIS NSN IS LISTED AS A PRIMARY QPL OR QML THEREFORE THE QUALIFIED PRODUCTS LIST OR QUALIFIED MANUFACTURERS LIST IS APPLICABLE.
CRITICAL APPLICATION ITEM
IAW BASIC SPEC NR MIL-PRF-19500R REVISION NR R DTD 07/24/2021 PART PIECE NUMBER: JANTXV1N4109-1
IAW REFERENCE SPEC NR MIL-PRF-19500/435R REVISION NR R DTD 11/23/2020 PART PIECE NUMBER: JANTXV1N4109-1
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7016687862 0001 EA 103.000
NSN/MATERIAL:5961013521802
DELIVERY (IN DAYS):0164
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:GX CLNG/DRY:1 PRESV MAT:00
WRAP MAT:K3 CUSH/DUNN MAT:P4 CUSH/DUNN THKNESS:C
UNIT CONT:B9 OPI:M
INTRMDTE CONT:E5 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:39 -39 ESD sensitiv electrnic dvce
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify
SPE7M5-26-T-160S
SECTION B
PR: 7016687862 PRLI: 0001 CONT’D
Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
PRESERVATION AND PACKAGING SHALL BE IAW THE LATEST REVISION OF MILITARY SPECIFICATION: MIL-DTL-19491, FOR SEMICONDUCTOR DEVICES. UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS
ESD and PHYSICAL protection are required for contacts, leads, terminals, and other protrusions by means of container design, cushioning, and/or other ESD protective devices. Components with pins or leads shall have adequate cushioning to PREVENT DAMAGE, BREAKAGE and/or BENDING OF LEADS when not specified in the packaging codes.
This item requires DOD QUALIFIED Electrostatic Discharge (ESD) and/or Electromagnetic Interference (EMI) protective packaging materials in accordance with MIL-PRF-81705. All items subject to degradation from ESD/EMI environmental field forces shall be handled and packaged at an approved field force protective work station.
For ESD protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used along with MIL-PRF-81705, Type III (MIL-DTL-117 Type II, Class H, Style 2) barrier material wrap if the contract doesn't specifically require ESD approved cushioning.
For EMI protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used.
The supplier shall be responsible for verifying that all MIL-PRF-81705 barrier materials (or converted bags) were supplied from a qualified manufacturer currently listed on QPL-81705.
For additional ESD/EMI packaging information, refer to the following DLA packaging website: https://www.dla.mil/HQ/LogisticsOperations/Packaging/PackFAQs/ESDS/
If the preservation method code in the solicitation does not specify ESD/EMI protection and the Offeror's proposed item of supply is subject
SPE7M5-26-T-160S
SECTION B
PR: 7016687862 PRLI: 0001 CONT’D
to degradation from ESD/EMI environmental field forces, Offerors shall provide appropriate technical packaging data with their proposals.
PARCEL POST ADDRESS:
SW3210
DLA DISTRIBUTION DEPOT HILL
7537 WARDLEIGH RD
HILL AFB UT 84056-5734
US
FOR TRANSPORTATION SEE DLAD DLAD PROC NOTE C19. FOR FIRST DESTINATION TRANSPORTATION SEE DLAD PROC NOTE
C20 AND CONTRACT
FREIGHT SHIPPING ADDRESS:
SW3210
DLA DISTRIBUTION DEPOT HILL
DDHU CML 385-519-8103
7537 WARDLEIGH RD BLDG 849W
HILL AFB UT 84056-5734
US
Need Ship Date:11/03/2026 Original Required Delivery Date:07/08/2026
SPE7M5-26-T-160S NSN/Part Number: 5961-01-352-1802 Quantity: 103 EA Purchase Request: 7016687862QTY: 103 Delivery: 164 days ADO
DIODE VOLTAGE REGULATOR SILICON
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL INDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
SPE7M5-26-T-160S
SECTION B
The Government Procuring Activity has determined that Surplus is not Acceptable for this NSN. (End of TQ Requirement)
THIS NSN IS LISTED AS A PRIMARY QPL OR QML THEREFORE THE QUALIFIED PRODUCTS LIST OR QUALIFIED MANUFACTURERS LIST IS APPLICABLE.
CRITICAL APPLICATION ITEM
IAW BASIC SPEC NR MIL-PRF-19500R REVISION NR R DTD 07/24/2021 PART PIECE NUMBER: JANTXV1N4109-1
IAW REFERENCE SPEC NR MIL-PRF-19500/435R REVISION NR R DTD 11/23/2020 PART PIECE NUMBER: JANTXV1N4109-1
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7016687862 0001 EA 103.000
NSN/MATERIAL:5961013521802
DELIVERY (IN DAYS):0164
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:GX CLNG/DRY:1 PRESV MAT:00
WRAP MAT:K3 CUSH/DUNN MAT:P4 CUSH/DUNN THKNESS:C
UNIT CONT:B9 OPI:M
INTRMDTE CONT:E5 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:39 -39 ESD sensitiv electrnic dvce
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify
SPE7M5-26-T-160S
SECTION B
PR: 7016687862 PRLI: 0001 CONT’D
Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
PRESERVATION AND PACKAGING SHALL BE IAW THE LATEST REVISION OF MILITARY SPECIFICATION: MIL-DTL-19491, FOR SEMICONDUCTOR DEVICES. UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS
ESD and PHYSICAL protection are required for contacts, leads, terminals, and other protrusions by means of container design, cushioning, and/or other ESD protective devices. Components with pins or leads shall have adequate cushioning to PREVENT DAMAGE, BREAKAGE and/or BENDING OF LEADS when not specified in the packaging codes.
This item requires DOD QUALIFIED Electrostatic Discharge (ESD) and/or Electromagnetic Interference (EMI) protective packaging materials in accordance with MIL-PRF-81705. All items subject to degradation from ESD/EMI environmental field forces shall be handled and packaged at an approved field force protective work station.
For ESD protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used along with MIL-PRF-81705, Type III (MIL-DTL-117 Type II, Class H, Style 2) barrier material wrap if the contract doesn't specifically require ESD approved cushioning.
For EMI protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used.
The supplier shall be responsible for verifying that all MIL-PRF-81705 barrier materials (or converted bags) were supplied from a qualified manufacturer currently listed on QPL-81705.
For additional ESD/EMI packaging information, refer to the following DLA packaging website: https://www.dla.mil/HQ/LogisticsOperations/Packaging/PackFAQs/ESDS/
If the preservation method code in the solicitation does not specify ESD/EMI protection and the Offeror's proposed item of supply is subject
SPE7M5-26-T-160S
SECTION B
PR: 7016687862 PRLI: 0001 CONT’D
to degradation from ESD/EMI environmental field forces, Offerors shall provide appropriate technical packaging data with their proposals.
PARCEL POST ADDRESS:
SW3210
DLA DISTRIBUTION DEPOT HILL
7537 WARDLEIGH RD
HILL AFB UT 84056-5734
US
FOR TRANSPORTATION SEE DLAD DLAD PROC NOTE C19. FOR FIRST DESTINATION TRANSPORTATION SEE DLAD PROC NOTE
C20 AND CONTRACT
FREIGHT SHIPPING ADDRESS:
SW3210
DLA DISTRIBUTION DEPOT HILL
DDHU CML 385-519-8103
7537 WARDLEIGH RD BLDG 849W
HILL AFB UT 84056-5734
US
Need Ship Date:11/03/2026 Original Required Delivery Date:07/08/2026
SPE7M5-26-T-160S NSN/Part Number: 5961-01-352-1802 Quantity: 103 EA Purchase Request: 7016687862QTY: 103 Delivery: 164 days ADO
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