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SEMICONDUCTOR DEVIC

Active
SPE7M5-26-T-457GFederal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This contract, identified as SPE7M5-26-T-457G, is for the procurement of one commercial off-the-shelf semiconductor device, specifically Littelfuse part number MDD 95-12N1B under NSN 5961-01-607-5742. The item is to be delivered to the USS Gerald R Ford (CVN 78) with a required delivery date of June 1, 2026, and a delivery window of 20 days. The government has explicitly stated that surplus items are not acceptable for this requirement. The contractor must adhere to strict quality and technical standards, including supply chain traceability documentation per DLA Directive C03 and qualification requirements for Federal Supply Classes 5961 and 5962. Specific packaging and marking mandates apply, including compliance with MIL-STD-129 and IPC/JEDEC J-STD-609 for identifying lead and lead-free attributes on unit packs. Shipping must be handled via the fastest traceable means, avoiding parcel post, and following DLA packaging requirements for procurement.

General Info

Procurement of one Littelfuse semiconductor device for USS Gerald R Ford by June 2026.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

334413 - Semiconductor and Related Device ManufacturingView NAICS

Place of Performance

UNIT 100328, BOX 1, FPO, AE, 09523, USA

Set-Aside

NONE

Documents

(1)

SPE7M5-26-T-457G.pdf

PDF

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Timeline

PhaseSolicitation
Posted

Solicitation

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
Contacts1 person available
OfficeUSA
Organization / Agency
Department Of Defense → ACTIVE DEVICES DIVISION
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Office AddressUSA

Full Description

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SEMICONDUCTOR DEVIC
SEMICONDUCTOR DEVIC
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL IDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
SPE7M5-26-T-457G
SECTION B
The Government Procuring Activity has determined that Surplus is not Acceptable for this NSN. (End of TQ Requirement)
RD003, COVERED DEFENSE INFORMATION POTENTIALLY APPLIES
THIS IS A COMMERCIAL OFF-THE-SHELF ITEM.
LITTELFUSE, INC. 75915 P/N MDD 95-12N1B
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7017014761 0001 EA 1.000
NSN/MATERIAL:5961016075742
DELIVERY (IN DAYS):0020
DELIVER FOB: DESTINATION
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:31 CLNG/DRY:1 PRESV MAT:00
WRAP MAT:EA CUSH/DUNN MAT:NA CUSH/DUNN THKNESS:B
UNIT CONT:E5 OPI:M
INTRMDTE CONT:E5 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:00 -00 No special marking
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid
SPE7M5-26-T-457G
SECTION B
PR: 7017014761 PRLI: 0001 CONT’D
State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
PARCEL POST ADDRESS:
V23173
USS GERALD R FORD CVN 78
UNIT 100328, BOX 1
FPO AE 09523
US
VESSEL SHIPMENT. TRANSPORTATION SEE DLAD PROC NOTE C19. FIRST DESTINATION TRANSPORTATION SEE DLAD PROC
NOTE C20 AND CONTRACT
FREIGHT SHIPPING ADDRESS:
V23173
USS GERALD R FORD CVN 78
DLA VENDORS: USE VSM FOR
US
RDD 777 SHIPMENT. SHIP BY FASTEST TRACEABLE MEANS. DO NOT USE PARCEL POST.
M/F: (TCN) V2317361295G06
RDD: 777
PROJ: EK5 TP 2
SUPP ADD: SIG: A
FOR GOVERNMENT USE ONLY: (IPD) 06
DIC: A4A DIST: 9B ADV: FC: DR
Need Ship Date:00/00/0000 Original Required Delivery Date:06/01/2026
SPE7M5-26-T-457G NSN/Part Number: 5961-01-607-5742 Quantity: 1 EA Purchase Request: 7017014761QTY: 1 Delivery: 20 days ADO

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