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Semiconductor Device Assembly (NSN 5961-0114-18824)

Open

Federal

Response Deadline11/23/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

General Info

Agency

Department Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

TUR

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-27-T-2771.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SEMICONDUCTOR DEVICE A

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Timeline

PostedNov 11

subcontract

Response DeadlineNov 23

Submission deadline

Response Deadline

11/23/2026, 05:00:00 PM UTCin 12 days

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

Office AddressN/A

ContactsNo contact information available

Full Description

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Supplies semiconductor device assemblies for prime contractors on Defense Logistics Agency (DLA) supply contracts. Manufactures part number 1581602-1 per Source Control Drawing MICRO USPD INC 12969 P/N 655-026 and Basic Drawing NR 83298 1581602 Revision E. Adheres to IPC/JEDEC J-STD-609 for marking and MIL-DTL-19491 for packaging. Requires DLA CDAP certification. Delivers two units of NSN 5961-0114-18824 with traceability documentation.

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Posted before this notice, open and closed

MICROCIRCUIT, LINEAR

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MICROCIRCUIT, HYBRID

Solicitation # SPE7M5-27-T-2764

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SEMICONDUCTOR DEVICE A

Solicitation # SPE7M5-27-T-2771

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Solicitation # SPE4A7-27-T-3768

DLA WEAPONS SUPPORT ASC SUPPLIER OPER AE AND AF DIV

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