This Government Contract opportunity from Department Of Defense was posted on September 10, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Semiconductor Device Cover Fabrication

Closed

Federal

Submission Closed09/21/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334413

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Supply of Sealed Lead Acid Battery Type I (NSN 6130016325119)This subcontract through the Defense Logistics Agency involves the supply of two Sealed Lead Acid Battery Type I power supply units for the USS BILLINGS (LCS-15). The hardware must strictly adhere to NSN 6130016325119 specifications and carries a non-extendable shelf life of 12 months. Compliance requirements include adherence to the Buy American Act and Berry Amendment, as well as MIL-STD-129 for marking and MIL-STD-2073-1E for packaging. Additionally, the provider must maintain CMMC Level 2 certification and follow MIL-STD-1916 sampling standards. The response deadline for this requirement is November 9, 2026.

Defense Logistics Agency

POSTED

about 5 hours ago

DEADLINE

in 12 days

AI Contract Overview

This subcontract involves the fabrication of 2,000 semiconductor device covers for the Department of Defense Active Devices Division. The manufacturer is required to produce the covers according to NSN 5961-01-550-4379 using precision molding equipment, with performance taking place in New Cumberland. Compliance is mandatory for IPC/JEDEC J-STD-609 marking and labeling standards as well as RA001 quality requirements. Additionally, the contractor must provide full supply chain traceability documentation. The solicitation was posted on September 10, 2026, with a response deadline of September 21, 2026, under NAICS code 334413.

General Info

Fabricate 2,000 semiconductor covers for DoD in New Cumberland per NSN specifications.

Agency

Department Of Defense → ACTIVE DEVICES DIVISION

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

NEW CUMBERLAND, PA, 17070-5002, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-471B.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

COVER, SEMICONDUCTOR DE

AI Contract Breakdown

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Timeline

PhaseClosed

PostedSep 10

subcontract

Response DeadlineSep 21

Deadline has passed

Submission Closed

09/21/2026, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

Office AddressN/A

ContactsNo contact information available

Full Description

Manufactures semiconductor device covers for prime contractors on DLA Land and Maritime Active Devices Division projects. Fabricates covers per NSN 5961-01-550-4379 using precision molding equipment. Applies marking and labeling per IPC/JEDEC J-STD-609 and complies with RA001 quality requirements. Provides supply chain traceability documentation. Delivers 2,000 finished semiconductor device covers.