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This Government Contract opportunity from Department Of Defense was posted on August 17, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Semiconductor Device (NSN 5961-00-816-0827) Supply

Closed
Federal

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This subcontract involves the manufacture and supply of a specific semiconductor device, identified by NSN 5961-00-816-0827, for prime contractors supporting U.S. Navy NAVSUP Weapon Systems Support projects. The selected provider must design and fabricate the device according to exact specifications, ensuring all items are packaged per MIL-STD-2073 and labeled according to MIL-STD-129. The contractor is required to utilize UID marking equipment and maintain CMMC compliance for the processing of Controlled Unclassified Information. The final deliverable consists of one semiconductor device featuring the required UID and standardized military packaging. This opportunity falls under NAICS code 334413 and is managed by the Department of Defense.

General Info

Manufacture and supply one semiconductor device (NSN 5961-00-816-0827) for U.S. Navy projects.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

PA

Set-Aside

NONE

Documents

This scope was carved out of N0010426QEE25.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SEMICONDUCTOR DEVIC

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Navsup Weapon Systems Support Mech
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Manufactures and supplies a specific semiconductor device for prime contractors on U.S. Navy NAVSUP WSS projects. Designs and fabricates the device to NSN 5961-00-816-0827 specifications. Packages items per MIL-STD-2073 and applies DLR labels per MIL-STD-129. Requires UID marking equipment and CMMC compliance for processing CUI. Delivers one semiconductor device with required UID and MIL-STD packaging.

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