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This Government Contract opportunity from Department Of Defense was posted on August 25, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Semiconductor Preservation and Packaging Services

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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AI Contract Overview

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This subcontract for Semiconductor Preservation and Packaging Services supports the Department of Defense Active Devices Division at Robins Air Force Base. The selected provider will perform specialized preservation and packaging for semiconductor devices intended for prime contractors on DLA Land and Maritime projects. All work must be executed in strict accordance with MIL-DTL-19491 for packaging and MIL-STD-2073-1E for packaging data compliance, utilizing approved materials and applying hazardous material warning labels as required by 29 CFR 1910.1200. The objective of the contract is to deliver preserved and packaged semiconductor units that are fully ready for shipment. This opportunity falls under NAICS code 488510 and was posted on August 25, 2026, with a response deadline of September 8, 2026.

General Info

Semiconductor preservation and packaging services for DoD at Robins Air Force Base.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

488510 - Freight Transportation ArrangementView NAICS

Place of Performance

ROBINS A F B, GA, 31098-1887, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-441B.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

TRANSISTOR

AI Contract Breakdown

Uniform Contract Format

No contract breakdown available.

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → ACTIVE DEVICES DIVISION
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

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Performs specialized preservation and packaging for semiconductor devices for prime contractors on DLA Land and Maritime Active Devices Division projects. Executes packaging per MIL-DTL-19491 and packaging data compliance per MIL-STD-2073-1E. Applies hazardous material warning labels in accordance with 29 CFR 1910.1200. Utilizes MIL-DTL-19491 compliant materials. Delivers preserved and packaged semiconductor units ready for shipment.

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