Single-Chip LiDAR System Integration and Demonstration

The contract aims to integrate optical phased arrays with control electronics and firmware to develop a fully functional solid-state LiDAR system on a single chip, advancing the state of the art in compact, scalable sensing technology. This effort focuses on combining photonic components with embedded control systems to enable precise beam steering without moving parts, targeting applications in autonomous systems and defense platforms where reliability, size, and performance are critical. Success requires demonstrating a complete, chip-scale LiDAR solution capable of accurate range and velocity detection under real-world conditions. The work is part of a subcontract under the Defense Advanced Research Projects Agency’s initiative to push the boundaries of integrated photonics and electronics, with the North American Industry Classification System code 334510 indicating alignment with semiconductor and related electronic manufacturing. The opportunity was posted on June 29, 2020, with a response deadline of July 14, 2020, and although specific performance location and point of contact details are not provided, the effort is expected to align with DARPA’s goals of accelerating innovation in next-generation sensing systems for national security applications.