This Government Contract opportunity from Department Of Defense was posted on August 2, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Specialized Packaging and Labeling Services for ESD-Sensitive Components
Contract Overview
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AI Contract Overview
The contract requires specialized packaging and labeling services for electronic components that must adhere to strict military standards, including MIL-STD-2073-1E for packaging, MIL-PRF-81705 for electrostatic discharge protection, and MIL-STD-129 for labeling. All components must be securely packaged to ensure survival during transit and storage, with integrated ESD safeguards to prevent damage from static electricity, and each item or shipment must be clearly labeled with compliant markings that support accurate identification, handling, and inventory control. The work is scoped as a subcontract under the Department of Defense’s Active Devices Division, with performance required at Joint Base MDL, ZIP 08733. The solicitation was posted on August 2, 2026, and responses are due by August 13, 2026, with no set-aside provisions specified. The NAICS code 322291 indicates the work falls within the category of Other Paper Product Manufacturing, which aligns with the production of specialized packaging materials. The contract is intended for a subcontractor capable of delivering fully compliant, high-reliability packaging and labeling solutions suitable for defense-grade electronic components. All deliverables must meet exacting military specifications without exception, and failure to comply with any standard could result in rejection of the shipment or termination of the subcontract.
General Info
Agency
NAICS
Place of Performance
JOINT BASE MDL, NJ, 08733, USASet-Aside
Documents
This scope was carved out of SPE7M5-26-T-365D.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
RESISTOR NETWORK, FI
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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