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This Government Contract opportunity from Department Of Defense was posted on May 18, 2015. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Sub-Micron Die-Bonder

Awarded
FA2823-15-Q-8004Federal

Contract Overview

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The Air Force Test Center Operational Contracting Squadron at Eglin AFB intends to award a sole source, firm-fixed price contract to Finetech for the procurement of specialized equipment. The acquisition includes one Finetech Fineplacer Manual Lambda Sub-Micron Die-Bonder Model A6HD and one Bonding Force Module Part FD3.1. This procurement is categorized under NAICS code 334413, with an anticipated award date of April 27, 2015. The government has determined that a sole source award is in its best interest because Finetech is the only known provider of a die-bonder capable of sub-micron accuracy for flip-chipping processes. This action is authorized under 10 USC 2304(c)(1) and FAR 13.106-1(b)(1). While this notice serves as an intent to award rather than a request for proposals, the agency allows responsible sources to submit bids or quotations for consideration within 10 calendar days of publication.

General Info

Contract Value

$118,450

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

FL, USA

Set-Aside

NONE

Awardee

FINETECH

Award Issued Date

Documents

0

No documents available

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Timeline

1 update
PhaseAwarded
Posted

special-notice

Notice updated

The notice description changed.

Awarded

Contract was awarded

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → FA2823 Aftc Pzio
Contacts1 person available
OfficeEGLIN AFB, FL, 32542-5418, USA
Office AddressEGLIN AFB, FL, 32542-5418, USA
Contacts

Full Description

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The Air Force Test Center Operational Contracting Squadron (AFTC/PZIOA) Eglin AFB, FL intends to award a sole source firm-fixed price contract to Finetech, 560 E. German Road Suite 103, Gilbert, AZ 85297-2943 for the purchase of one (1) Finetech Fineplacer Manual Lambda Sub-Micron Die-Bonder and one (1) Bonding Force Module. Anticipated Award Date is 27 APRIL 2015. It is in the best interest of the Government to award a sole source contract. CLIN 0001: Finetech Fineplacer Manual Lambda Sub-Micron Die-Bonder, Model A6HD, QTY: 1 EA. CLIN 0002: Bonding Force Module, Part #FD3.1, QTY: 1 EA. The statutory authority which permits other than full and open competition for this acquisition is 10 United States Code (USC) 2304 (c)(1), as implemented by FAR 13.106-1(b)(1). Finetech is the only known source of a die-bonder with sub-micron accuracy for flip-chipping processes. The applicable NAICS code is 334413. The size standard is defined by the U.S. Small Business Administration is 500 employees. THIS NOTICE OF INTENT IS NOT A REQUEST FOR COMPETITIVE PROPOSALS OR QUOTATIONS. However, all responsible sources may submit a bid, proposal, or quotation which shall be considered by the agency. The Government will consider all responses received within 10 calendar days of publication. A determination by the Government not to compete this proposed contract based upon responses to this notice is solely within the discretion of the Government. Questions shall be submitted electronically to contact@example.gov.

More opportunities from Department Of Defense → FA2823 Aftc Pzio

Same awarding agency

NAICS: 334417
New
Federal
Harsh Environment Circular Connector Accessories
Solicitation # FA282327Q0004
Solicitation FA2823-27-Q-0004 is a request for quote issued by the Air Force Test Center at Eglin Air Force Base for the procurement of 270 Robert Technologies heavy-duty circular electrical connectors, part number RT9730-19-12S-546. These connectors are intended for use in military ground support equipment and industrial machinery, requiring compliance with MIL-DTL-22992 Class L standards and IP67 environmental sealing. A Determination and Findings document justifies this as a single-source procurement because no other manufacturer provides a drop-in replacement that matches the proprietary form, fit, and configuration. The contract will be awarded as a firm-fixed-price purchase order to the lowest priced, responsible offeror that meets all minimum technical requirements. Quotes must be submitted in English and U.S. dollars to Kristina Brannon by 12:00 CST on November 3, 2026. Delivery is required within 26 weeks after the date of award receipt, with shipping terms set as FOB Destination to Eglin AFB, Florida. Offerors must be registered in the System for Award Management and the Wide Area WorkFlow system for payment. The solicitation includes a price evaluation preference for HUBZone small business concerns and requires strict adherence to packaging and marking standards to protect against moisture and physical damage. Quality assurance includes visual examinations, dimensional checks, and potential First Article Inspection requirements.
Electronic Connector Manufacturing

POSTED

4 days ago

DEADLINE

in 2 days
View Details

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