This Government Contract opportunity from National Aeronautics And Space Administration was posted on June 26, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Supply of Aluminum Nitride (AlN) Substrates
Contract Overview
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NASA is seeking a subcontractor to supply high-purity aluminum nitride (AlN) substrates engineered for use in multichip module (MCM) packaging, with strict requirements including a coefficient of thermal expansion (CTE) no greater than 4 ppm/°C, minimal defect density, and verified thermal performance characteristics. These substrates must meet exacting standards to ensure reliability and performance in high-temperature aerospace and advanced electronics applications. The solicitation is open for responses until June 30, 2026, at 12:00 PM, with work performance expected to take place in Cleveland, Ohio, under the oversight of the NASA Shared Services Center. The NAICS code 325992 indicates the industry classification for other chemical product and preparation manufacturing, emphasizing the specialized nature of the material production required.
General Info
Agency
NAICS
Place of Performance
Cleveland, OH, 44135, USASet-Aside
Documents
This scope was carved out of 80NSSC26936730Q.
The full solicitation package (3 documents), including the RFP, is on the prime solicitation, not on this scope.
Multichip Module Package for SiC Pressure Sensors
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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