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Supply of Aluminum Nitride (AlN) Substrates

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NASA is seeking a subcontractor to supply high-purity aluminum nitride (AlN) substrates engineered for use in multichip module (MCM) packaging, with strict requirements including a coefficient of thermal expansion (CTE) no greater than 4 ppm/°C, minimal defect density, and verified thermal performance characteristics. These substrates must meet exacting standards to ensure reliability and performance in high-temperature aerospace and advanced electronics applications. The solicitation is open for responses until June 30, 2026, at 12:00 PM, with work performance expected to take place in Cleveland, Ohio, under the oversight of the NASA Shared Services Center. The NAICS code 325992 indicates the industry classification for other chemical product and preparation manufacturing, emphasizing the specialized nature of the material production required.

General Info

Supply high-purity AlN substrates with CTE ≤4 ppm/°C for NASA MCM packaging in Cleveland, Ohio, by June 30, 2026.

Agency

National Aeronautics And Space Administration → NASA Shared Services CenterView Agency

NAICS

325992 - Photographic Film, Paper, Plate, Chemical, and Copy Toner Manufacturing View NAICS

Place of Performance

Cleveland, OH, 44135, USA

Set-Aside

NONE

Documents

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No documents available

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Organization & Contact Information

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AgencyNational Aeronautics And Space Administration → NASA Shared Services Center
ContactsNo contacts available
OfficeN/A
Organization / Agency
National Aeronautics And Space Administration → NASA Shared Services Center
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Office AddressN/A
ContactsNo contact information available

Full Description

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Supply of high-purity AlN substrates with CTE ≤4 ppm/°C, low defect density, and certified thermal performance for use in MCM packaging.

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