Surface Mount Technology (SMT) Production Line Optimization

The contract titled Surface Mount Technology (SMT) Production Line Optimization aims to enhance the throughput and yield of existing SMT assembly lines through targeted process engineering, precise machine calibration, and the implementation of workflow automation strategies. The primary objective is to improve the efficiency of printed circuit board manufacturing, specifically for Component Carry Assembly (CCA), by reducing cycle times, minimizing defects, and maximizing output consistency across production runs. The work will involve detailed analysis of current line performance, identification of bottlenecks, and the deployment of advanced controls and software solutions to streamline operations without requiring major hardware overhauls. This subcontract is issued under the NAICS code 334418 and is tied to a Department of Defense procurement managed by the W6QK Acc-Apg Cont Ct Tyad Ofc. Performance is required at the Tobyhanna location with ZIP code 18466. The Solicitation was posted on July 10, 2026, with a firm response deadline of August 10, 2026, at 6:00 PM Eastern Time. No set aside classification is specified, and the contract is open to qualified subcontractors capable of delivering process improvements in a high-reliability manufacturing environment aligned with defense standards.