This Government Contract opportunity from Department Of Defense was posted on September 27, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Transistor Component Manufacturing

Closed

Federal

Submission Closed10/08/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334413

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Printed Circuit Board (PCB) FabricationThis subcontract opportunity is for the fabrication and supply of bare printed circuit boards to support prime contractors on DLA Weapons Support Maritime Supply Chain projects. The scope of work involves producing multi-layer PCBs in accordance with TDP Rev B Gen 2 specifications, which includes the application of silkscreens, solder masks, and the drilling and plating of vias using military-grade electrical and thermal materials. Performance will take place in Fort Bragg, North Carolina. This is a total small business set-aside under NAICS code 334413. Due to the nature of the defense materials, the selected provider must maintain US/Canada Joint Certification Program certification and ensure full compliance with ITAR and EAR regulations. Interested parties must submit their responses by November 9, 2026.

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POSTED

about 16 hours ago

DEADLINE

in 11 days

AI Contract Overview

This subcontract for the Active Devices Division of the Department of Defense involves the manufacturing of transistors for prime contractors. The scope of work requires the production of components within semiconductor fabrication facilities and cleanroom environments, utilizing high-purity gallium or silicon substrates. The manufacturer must ensure all products undergo quality control and validation according to semiconductor industry standards. Compliance with Federal Standard No. 313 for hazardous materials and IPC/JEDEC J-STD-609 for marking is mandatory. The contract falls under NAICS code 334413, with a response deadline of October 8, 2026.

General Info

DoD subcontract for manufacturing transistors using semiconductor standards, deadline October 8, 2026.

Agency

Department Of Defense → ACTIVE DEVICES DIVISION

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-536S.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

TRANSISTOR

AI Contract Breakdown

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Timeline

PhaseClosed

PostedSep 27

subcontract

Response DeadlineOct 8

Deadline has passed

Submission Closed

10/08/2026, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

Office AddressN/A

ContactsNo contact information available

Full Description

Manufactures transistors for prime contractors on Active Devices Division projects. Produces components in semiconductor fabrication facilities and cleanroom environments using high-purity silicon or gallium substrates. Performs quality control and validation per semiconductor industry standards. Complies with IPC/JEDEC J-STD-609 for marking and Federal Standard No. 313 for hazardous materials. Delivers finished transistors.