SIENNA TECHNOLOGIES, INC.

Sienna Technologies, Inc. specializes in the design, fabrication, and packaging of high-reliability silicon carbide (SiC) pressure and temperature sensors for extreme-environment aerospace applications. Their core expertise lies in multi-chip module (MCM) integration, on-chip sensor packaging, and the hybrid assembly of SiC-based electronic components capable of withstanding high temperatures, radiation, and mechanical stress. The company demonstrates deep proficiency in microelectromechanical systems (MEMS) packaging, die bonding, hermetic sealing, and sensor signal conditioning circuit integration—critical for mission-critical systems where conventional silicon devices fail. Their technical differentiator is the end-to-end capability to transition sensor chip prototypes into flight-qualified, packaged subsystems, particularly for NASA’s deep space and planetary exploration platforms. Sienna Technologies maintains a consistent and focused relationship with the National Aeronautics and Space Administration, delivering specialized sensor packaging solutions for planetary probes, propulsion systems, and in-situ instrumentation. Their work for NASA centers on enabling real-time environmental monitoring under extreme conditions, supporting missions requiring robust, miniaturized sensing with minimal power consumption and high thermal stability. The company’s primary industry focus is in other electronic component manufacturing and related research and development, specifically serving the aerospace and defense sector’s demand for next-generation sensor systems. They position themselves as a niche provider of high-temperature, radiation-tolerant electronics packaging, bridging the gap between lab-scale sensor development and space-qualified hardware integration. Sienna Technologies, Inc. is a small business structured as a 2L entity, headquartered in Mukilteo, Washington. While currently holding no formal government certifications, their technical track record and direct engagement with NASA underscore a strong reputation for mission-critical electronics manufacturing within the U.S. space ecosystem.