This Pre-Solicitation opportunity from Department Of Defense was posted on January 27, 2005. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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36--The purpose of this Notice is to purchase one (1) Substrate Bonding System

Closed

W31P4Q-05-P-R011Federal

Submission Closed02/08/2005, 05:00:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 333298

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DEADLINE

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AI Contract Overview

The US Army Aviation and Missile Command Acquisition Center intends to award a sole-source purchase order to Suss MicroTec, Inc. for the procurement of one Substrate Bonding System. This equipment is designated for use by the RDE Center Weapons Science Directorate to support the fabrication of microfluidic devices, micro-optical components, MEMS/NEMS devices, and polymer and semiconductor optical waveguide devices. The required system must be compatible with Karl Suss Wafer Transport Fixtures. Because the government has determined that Suss MicroTec, Inc. is the only source capable of meeting all technical specifications, this procurement will be negotiated directly with the vendor without a competitive solicitation process.

General Info

US Army sole-source purchase of one Substrate Bonding System from Suss MicroTec, Inc.

Agency

Department Of Defense → W6QK Acc-Rsa

NAICS

333298 - All Other Industrial Machinery Manufacturing

Place of Performance

US Army Aviation and Missile Command (Missile); RDEC, Weapons Science Directorate; Bldg 7804 ATTN: AMSRD-AMR-WS-ID Redstone Ar, AL

Set-Aside

NONE

Documents

No documents available

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Timeline

PhaseClosed

PostedJan 27

Presolicitation

Response DeadlineFeb 8

Deadline has passed

Submission Closed

02/08/2005, 05:00:00 AM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → W6QK Acc-Rsa

ContactsNo contacts available

OfficeREDSTONE ARSENAL, AL, 35898-5090, USA

Organization / AgencyDepartment Of Defense → W6QK Acc-Rsa

Office AddressREDSTONE ARSENAL, AL, 35898-5090, USA

ContactsNo contact information available

Full Description

The US Army Aviation and Missile Command (AMCOM), Acquisition Center, Operations and Services Directorate, Research, Development and Engineering (RDE), Division A (AMSAM-AC-OS-RAY) plans to generate a Purchase Order (PO) for the RDE Center (RDEC), We apons Science Directorate. The proposed procurement is for an item that the Government intends to solicit and negotiate only with one source thus this Notice is not a request for Competitive Quotes and no written Solicitation will be issued. The Governme nt intends to award to Suss MicroTec, Inc., 228 Suss Drive, Waterbury Center, Vermont (VT), 05677-8296. The Contractor shall deliver one (1) Substrate Bonding System. The Substrate Bonding System must be capable of accepting Karl Suss Wafer Transport Fix tures. The Wafer Substrate Bonder will be used in the fabrication of polymer and semiconductor optical waveguide devices, MEMS/NEMS devices, micro-optical components and microfluidic devices. This Contractor meets all Government Specifications. Point of Contact for this procurement is Karin Zippmann, Contract Specialist, +1 (555) 000-0000 and/or Earnest Taylor, Contracting Officer, +1 (555) 000-0000. See Numbered Note 22.