This Government Contract opportunity from Department Of Defense was posted on April 16, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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3D Heterogeneous Integration (3DHI) Microsystem Design

Closed

Federal

Submission Closed07/31/2026, 11:59:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 541715

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about 6 hours ago

DEADLINE

in 28 days

AI Contract Overview

This contract focuses on the development and validation of a 3D-heterogeneously integrated microsystem design, utilizing DARPA’s Next Generation Microsystems Manufacturing (NGMM) 3D-Advanced Development Kit (3D-ADK) alongside commercial Electronic Design Automation (EDA) tools. The project supports the integration of mixed-material systems comprising silicon (Si), gallium nitride (GaN), and indium phosphide (InP), aiming to advance microsystem technology by leveraging heterogeneous materials to enhance performance and functionality. Issued by the Defense Advanced Research Projects Agency (DARPA) under the Department of Defense, this subcontract falls under the NAICS code 541715. The solicitation was posted in mid-April 2026, with responses due by the end of July 2026. While specific location details for performance and contact information are not provided, the scope indicates a highly specialized effort focused on cutting-edge microsystem design, contributing to national defense technology capabilities.

General Info

Development of 3D-heterogeneous microsystems using DARPA’s NGMM 3D-ADK and mixed-material integration.

Agency

Department Of Defense → Defense Advanced Research Projects Agcy

NAICS

541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)

Place of Performance

Set-Aside

NONE

Documents

This scope was carved out of DARPA-SN-26-69.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

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Timeline

PhaseClosed

PostedApr 16

subcontract

Response DeadlineJul 31

Deadline has passed

Submission Closed

07/31/2026, 11:59:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → Defense Advanced Research Projects Agcy

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → Defense Advanced Research Projects Agcy

Office AddressN/A

ContactsNo contact information available

Full Description

Develop and validate a 3D-heterogeneously integrated microsystem design using DARPA’s NGMM 3D-ADK and commercial EDA tools, supporting mixed-material systems like Si, GaN, and InP.