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This Solicitation opportunity from Department Of Defense was posted on September 10, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

RECTIFIER, SEMICONDUCTO

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SPE7M5-26-T-482MFederal

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Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334413
New
DIBBS
MICROCIRCUIT, LINEAR
Solicitation # SPE7M5-27-T-1071
Solicitation SPE7M5-27-T-1071 is a total small business set-aside issued by the DLA Weapons Support Active Devices Division for the procurement of 19 linear microcircuits, identified as NSN 5962-01-394-2132. This is a critical application item that must be sourced from the Qualified Manufacturers List (QML) and adhere to TDP Rev B Gen 2, Basic Drawing NR 67268 81006, Revision NR L. The contract is a fixed-price acquisition with a need ship date of November 12, 2026, and an original required delivery date of May 28, 2027. Delivery is FOB Origin, with inspection and acceptance occurring at the destination in Columbus, Ohio. The contractor must adhere to stringent quality and security requirements, including a CMMC Level 2 Self-Assessment and strict supply chain traceability. Documentation, specifically DLA Land and Maritime Form 918 and unredacted traceability or test reports, must be submitted via email for approval at least 15 days prior to the delivery date; shipment is prohibited without written authorization from the contract administrator. Packaging must meet MIL-STD-2073-1E and MIL-PRF-81705 standards for ESD and EMI protection, while marking must comply with MIL-STD-129 and IPC/JEDEC J-STD-609 to identify lead and lead-free attributes. Payment will be processed electronically through the Wide Area WorkFlow system.
DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

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NAICS: 334413
New
DIBBS
MICROCIRCUIT, DIGITA
Solicitation # SPE7M5-27-T-1056
Solicitation SPE7M5-27-T-1056 is a fixed-price procurement by the DLA Weapons Support Active Devices Division for 12 units of a digital microcircuit, identified as NSN 5962012658198. This is designated as a critical application item and must be manufactured according to Drawing 5962-87802 Revision E. The acquisition is restricted to approved sources of supply, and the government will not evaluate offers involving additive manufacturing. The need ship date is October 6, 2026, with an original required delivery date of January 31, 2027, and delivery is set as FOB Origin to DLA Distribution DDWO in Columbus, Ohio. The contract mandates rigorous quality and packaging standards, including DoD qualified ESD and EMI protective materials per MIL-PRF-81705 and specific cushioning requirements under A-A-59136 to prevent lead damage. Contractors must provide comprehensive supply chain traceability documentation and a completed DLA Land and Maritime Form 918 at least 15 days prior to delivery; shipment is prohibited until written authorization is received from the contract administrator. Additionally, the item must comply with IPC/JEDEC J-STD-609 for lead finish marking and MIL-STD-129 for general marking. Compliance with CMMC Level 2 self-assessment, the Buy American Act, and the prohibition of intentionally added mercury is also required.
DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

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about 16 hours ago

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Solicitation SPE7M5-26-T-482M is a total small business set-aside issued by the DLA Land and Maritime Active Devices Division for the procurement of five unitized semiconductor device rectifiers, identified by NSN 5961-01-400-0888. The requirement is for a critical application item with a delivery period of 168 days, featuring a need ship date of March 9, 2027, and an original required delivery date of November 27, 2027. Terms are set as FOB Origin, with inspection and acceptance occurring at the destination, specifically the DLA Distribution DDSP New Cumberland facility in Pennsylvania. The contract mandates rigorous technical and quality standards, including CMMC Level 2 self-assessment and strict supply chain traceability documentation. Packaging must adhere to MIL-STD-2073-1E and MIL-STD-129, with specific requirements for DOD qualified ESD and EMI protective materials per MIL-PRF-81705 to prevent damage to leads and terminals. Additionally, contractors must apply lead finish markings according to IPC/JEDEC J-STD-609. Compliance with the Buy American Act and Berry Amendment is required, and all payment requests must be processed through the Wide Area WorkFlow system.

General Info

DLA seeks quotes for five semiconductor rectifiers from small businesses by September 21, 2026.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

2083 NORMANDY DRIVE DOOR 113 TO 134, NEW CUMBERLAND, PA, 17070-5002, USA

Set-Aside

SBA

Documents

1

SPE7M5-26-T-482M Request for Quotations

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Timeline

PhaseClosed
Posted

Combined Synopsis

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Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
Contacts1 person available
OfficeUSA
Office AddressUSA

Full Description

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RECTIFIER,SEMICONDUCTOR DEVICE,UNITIZED
RECTIFIER,SEMICONDUCTOR
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RD002, COVERED DEFENSE INFORMATION APPLIES
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL IDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
SPE7M5-26-T-482M
SECTION B
MICROCIRCUITS
The Government Procuring Activity has determined that Surplus is not Acceptable for this NSN. (End of TQ Requirement) ZZ ADDITIONAL SPECIAL MARKING: 39 ESD sensitive electronic device requirements of MIL-STD-129 apply ESD and PHYSICAL protection are required for contacts, leads, terminals, and other protrusions by means of container design, cushioning, and/or other ESD protective devices. Components with pins or leads shall have adequate cushioning to PREVENT DAMAGE, BREAKAGE and/or BENDING OF LEADS when not specified in the packaging codes.
This item requires DOD QUALIFIED Electrostatic Discharge (ESD) and/or Electromagnetic Interference (EMI) protective packaging materials in accordance with MIL-PRF-81705. All items subject to degradation from ESD/EMI environmental field forces shall be handled and packaged at an approved field force protective work station.
For ESD protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used along with MIL-PRF-81705, Type III (MIL-DTL-117 Type II, Class H, Style 2) barrier material wrap if the contract doesn't specifically require ESD approved cushioning.
For EMI protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used.
The supplier shall be responsible for verifying that all MIL-PRF-81705 barrier materials (or converted bags) were supplied from a qualified manufacturer currently listed on QPL-81705.
For additional ESD/EMI packaging information, refer to the following DLA packaging website: https://www.dla.mil/HQ/LogisticsOperations/Packaging/PackFAQs/ESDS/
If the preservation method code in the solicitation does not specify ESD/EMI protection and the Offeror's proposed item of supply is subject to degradation from ESD/EMI environmental field forces, Offerors shall provide appropriate technical packaging data with their proposals.
RD004: Cybersecurity Maturity Model Certification (CMMC) Level 2 Self-Assessment RD004: Cybersecurity Maturity Model Certification (CMMC) Level 2 Self-Assessment
CRITICAL APPLICATION ITEM
RAYTHEON COMPANY 82577 P/N H8000318-001F RSM ELECTRON POWER INC 13409 P/N SEN-1840
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7018273874 0001 EA 5.000
NSN/MATERIAL:5961014000888
SPE7M5-26-T-482M
SECTION B
PR: 7018273874 PRLI: 0001 CONT’D
DELIVERY (IN DAYS):0168
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:GX CLNG/DRY:1 PRESV MAT:00
WRAP MAT:00 CUSH/DUNN MAT:NB CUSH/DUNN THKNESS:A
UNIT CONT:B9 OPI:M
INTRMDTE CONT:E5 INTRMDTE CONT QTY:100
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
ESD and PHYSICAL protection are required for contacts, leads, terminals, and other protrusions by means of container design, cushioning, and/or other ESD protective devices. Components with pins or leads shall have adequate cushioning to PREVENT DAMAGE, BREAKAGE and/or BENDING OF LEADS when not specified in the packaging codes.
This item requires DOD QUALIFIED Electrostatic Discharge (ESD) and/or Electromagnetic Interference (EMI) protective packaging materials in accordance with MIL-PRF-81705. All items subject to degradation from ESD/EMI environmental field forces shall be handled and packaged at an approved field force protective work station.
For ESD protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used along with MIL-PRF-81705, Type III (MIL-DTL-117 Type II, Class H, Style 2) barrier material wrap if the contract doesn't specifically require ESD approved cushioning.
For EMI protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used.
The supplier shall be responsible for verifying that all MIL-PRF-81705 barrier materials (or converted bags) were supplied from a qualified manufacturer currently listed on QPL-81705.
For additional ESD/EMI packaging information, refer to the following DLA packaging website: https://www.dla.mil/HQ/LogisticsOperations/Packaging/PackFAQs/ESDS/
If the preservation method code in the solicitation does not specify ESD/EMI protection and the Offeror's proposed item of supply is subject to degradation from ESD/EMI environmental field forces, Offerors shall provide appropriate technical packaging data with their proposals.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in
SPE7M5-26-T-482M
SECTION B
PR: 7018273874 PRLI: 0001 CONT’D
accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
ZZ ADDITIONAL SPECIAL MARKING: 39 ESD sensitive electronic device requirements of MIL-STD-129 apply
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS
PARCEL POST ADDRESS:
W25G1U
W1A8 DLA DISTRIBUTION
DDSP NEW CUMBERLAND FACILITY
2083 NORMANDY DRIVE DOOR 113 TO 134
NEW CUMBERLAND PA 17070-5002
US
FOR TRANSPORTATION SEE DLAD DLAD PROC NOTE C19. FOR FIRST DESTINATION TRANSPORTATION SEE DLAD PROC NOTE
C20 AND CONTRACT
FREIGHT SHIPPING ADDRESS:
W25G1U
W1A8 DLA DISTRIBUTION
DDSP NEW CUMBERLAND FACILITY
2083 NORMANDY DRIVE DOOR 113 TO 134
NEW CUMBERLAND PA 17070-5002
US
Need Ship Date:03/09/2027 Original Required Delivery Date:11/27/2027
SPE7M5-26-T-482M NSN/Part Number: 5961-01-400-0888 Quantity: 5 EA Purchase Request: 7018273874QTY: 5 Delivery: 168 days ADO

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New
DIBBS
CIRCUIT BREAKER
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Switchgear and Switchboard Apparatus Manufacturing

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