CIRCUIT CARD ASSEMBLY

The solicitation for Circuit Card Assembly under number SPRRA2-26-Q-0050 seeks the production of 15 units of a specific assembly identified by NSN 5998-01-307-9107 and part number 319466-1, including one unit for First Article Testing. All units must be manufactured in compliance with rigorous military standards including MIL-STD-2073-1 for packaging and MIL-STD-129 for marking, with each item uniquely identified via IUID marking as required, though serialization is not mandated. Packaging must conform to specific J-codes from MIL-STD-2073-1 Appendix J, use MILITAR® preservation levels, and comply with ISPM-15 for any wood packaging. The contract is managed by the Department of Defense’s DLA Aviation at Redstone Arsenal, Alabama, with delivery directed to the Letterkenny Transportation Office in Chambersburg, Pennsylvania. The acquisition follows a Lowest Priced Technically Acceptable evaluation methodology, where proposals are evaluated for full compliance with all technical and administrative requirements—failure to meet any requirement renders a proposal ineligible regardless of price. Among the critical technical obligations are adherence to DPAS ratings DO and DX, which impose priority production demands and require immediate notification to DLA upon any potential schedule deviation, with BIS-999 forms to be submitted for assistance. Offerors must access technical data via the secure DoD SAFE portal and hold an active Joint Certification Program credential if their supply chain involves export-controlled information. Contract administration is overseen by Contracting Officer Thomas Gunter and Contract Specialist Michael Romine, with post-award submissions directed to the designated DLA email. Pricing details are absent from the solicitation documents, preventing any estimate of contract value, though the terms imply a firm-fixed-price structure consistent with the LPTA approach. The government retains full responsibility for inspection and acceptance at the origin, validating conformity with all MIL-STDs, DPAS obligations, and IUID compliance. While the solicitation references FAR clauses related to trade agreements such as the WTO GPA and Buy American Act provisions, no specific FAR clauses are explicitly listed or filled in; instead, the solicitation relies on form-based affirmations for DPAS, IUID, and FAT requirements. Offerors must submit cost and pricing data per FAR 15.4, and any materially unbalanced pricing will result in disqualification. The deadline for proposals is July