Component Lead Finish Marking (IPC/JEDEC J-STD-609)
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The contract requires compliance with IPC/JEDEC J-STD-609 standards for marking component leads to clearly identify lead finish types, including lead-containing and lead-free finishes, ensuring accurate placement and thorough documentation throughout the manufacturing process. This specification is critical for maintaining material traceability, supporting regulatory compliance, and preventing misassembly in electronic assemblies used in defense applications. The work must be performed at the designated place of performance in Columbus, Ohio, with a zip code of 43213, and is classified under NAICS code 334413 for semiconductor and other electronic component manufacturing. As a subcontract opportunity issued by the Department of Defense’s Active Devices Division, it has a response deadline of July 31, 2026, and was posted on July 20, 2026, with no set-aside provisions specified.
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COLUMBUS, OH, 43213, USSet-Aside
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