This Government Contract opportunity from Department Of Defense was posted on April 29, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Custom 28-QFN Package Manufacturing with Lids

Closed

Federal

Submission Closed05/04/2026, 04:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334418

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POSTED

3 days ago

DEADLINE

in 8 days

AI Contract Overview

The contract calls for the fabrication of 50 custom 28-pin QFN packages with lids, encompassing all critical manufacturing steps including die attach, 1-mil gold wire bonding, optical inspection, epoxy lid sealing, and top marking to ensure full functional and aesthetic compliance. Each package must meet stringent quality standards with inspection protocols verifying bond integrity, seal quality, and marking accuracy prior to delivery. The work is designated as a Total Small Business Set-Aside under FAR 19.5, with the NAICS code 334418 indicating classification within semiconductor and related electronic component manufacturing. Performance is required at the designated location in San Diego, CA 92110, and responses must be submitted by May 4, 2026, at 4:00 PM local time. This subcontract is issued by Niwc Pacific under the Department of Defense and is solicited through the federal procurement system to support defense-related electronics requirements.

General Info

Fabricate 50 custom 28-pin QFN packages with lids for DoD in San Diego by May 4, 2026, as small business set-aside.

Agency

Department Of Defense → Niwc Pacific

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

San Diego, CA, 92110, USA

Set-Aside

SBA

Documents

This scope was carved out of N66001-26-Q-6110.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

NOTICE: Intent to Award Sole Source – GOLDEN ALTOS CORPORATION – for QFN packages and QFN test sockets for custom designed IC

AI Contract Breakdown

Uniform Contract Format

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The breakdown needs solicitation documents. None were found from this contract's source.

Timeline

PhaseClosed

PostedApr 29

subcontract

Response DeadlineMay 4

Deadline has passed

Submission Closed

05/04/2026, 04:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → Niwc Pacific

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → Niwc Pacific

Office AddressN/A

ContactsNo contact information available

Full Description

Fabrication of 50 custom 28-pin QFN packages with lids, including die attach, 1-mil gold wire bonding, optical inspection, epoxy lid sealing, and top marking.