Custom 28-QFN Package Manufacturing with Lids

The contract calls for the fabrication of 50 custom 28-pin QFN packages with lids, encompassing all critical manufacturing steps including die attach, 1-mil gold wire bonding, optical inspection, epoxy lid sealing, and top marking to ensure full functional and aesthetic compliance. Each package must meet stringent quality standards with inspection protocols verifying bond integrity, seal quality, and marking accuracy prior to delivery. The work is designated as a Total Small Business Set-Aside under FAR 19.5, with the NAICS code 334418 indicating classification within semiconductor and related electronic component manufacturing. Performance is required at the designated location in San Diego, CA 92110, and responses must be submitted by May 4, 2026, at 4:00 PM local time. This subcontract is issued by Niwc Pacific under the Department of Defense and is solicited through the federal procurement system to support defense-related electronics requirements.