This Government Contract opportunity from Department Of Defense was posted on July 29, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Defense-Grade Digital Microcircuit Manufacturing and Assembly
Contract Overview
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AI Contract Overview
The contract encompasses the full lifecycle manufacturing of defense-grade digital microcircuits, covering all phases from wafer fabrication through packaging, testing, and rigorous quality assurance, ensuring compliance with stringent military standards. This subcontract is focused on producing high-reliability electronic components critical to national defense systems, with all work required to be performed in accordance with established military specifications and protocols to guarantee performance under extreme operational conditions. The place of performance is designated as Columbus, Ohio, with a zip code of 43213, indicating the physical location where manufacturing and assembly activities will occur. The NAICS code 334413 confirms the classification under semiconductor and related device manufacturing. The solicitation was posted on July 29, 2026, with a response deadline of August 10, 2026, and is managed by the Active Devices Division under the Department of Defense. Contractors must meet high standards of technical capability, security clearance, and quality control to be eligible for award.
General Info
Place of Performance
COLUMBUS, OH, 43213, USASet-Aside
Documents
This scope was carved out of SPE7M5-26-T-358C.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
MICROCIRCUIT, DIGITAL
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
More opportunities from Department Of Defense → ACTIVE DEVICES DIVISION
Same awarding agency
Earlier notices in this NAICS code
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