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This Government Contract opportunity from Department Of Defense was posted on July 23, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Digital Microcircuit Manufacturing (Semiconductor Fabrication)

Closed
Federal

Contract Overview

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The contract encompasses the full lifecycle manufacturing of a digital microcircuit adhering to strict military specifications, covering all phases from wafer fabrication through testing, packaging, and final delivery. Production must comply with defense-grade standards, ensuring reliability and performance under demanding operational conditions. The work is designated as a subcontract under NAICS code 334413, specifically for semiconductor fabrication, and is managed by the Active Devices Division within the Department of Defense. All manufacturing activities are required to be performed at the designated place of performance in Columbus, Ohio, with the zip code 43213. Proposals must be submitted by the response deadline of August 3, 2026, and the opportunity was posted on July 23, 2026, with no set-aside provisions identified.

General Info

Manufacture military-grade microcircuits in Columbus, Ohio, by August 3, 2026, per NAICS 334413.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-350G.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, DIGITA

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Full lifecycle manufacturing of a digital microcircuit per military specifications, including wafer fabrication, testing, packaging, and delivery.

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