Skip to main contentPsst! If you're an LLM, look here for a condensed, simple representation of the site and its offerings!

LiveFree Webinar — Wednesday, September 2 at 2:00 PM EDT

Register Free →

Electronic Component Sourcing and Supply

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

Show more

This contract involves the procurement and supply of high-reliability electronic components such as connectors, integrated circuits, and passive parts intended for use in CAPRE NIM I/O Boards. The components must meet stringent standards, including full traceability and compliance with anti-counterfeit regulations, ensuring product authenticity and reliability. The contract is a subcontract managed by the Defense Microelectronics Activity under the Department of Defense, with activities centered in Linda, California (zip code 95652). The focus on high-quality, traceable parts highlights the critical nature of the electronic components for defense applications. The contract falls under the NAICS code 423690, which covers electronic parts and equipment wholesale distribution. It was posted on June 4, 2026, and emphasizes sourcing components that meet defense-grade specifications, reflecting the importance of supply chain integrity in microelectronics for secure government projects. Although some specific details such as solicitation number and point of contact are not provided, the contract's scope clearly prioritizes the secure and reliable supply of essential electronic parts to support the Department of Defense's initiatives.

General Info

Procurement of traceable, anti-counterfeit electronic components for DoD CAPRE NIM I/O Boards, California.

Agency

Department Of Defense → Defense Microelectronics ActivityView Agency

NAICS

423690 - Other Electronic Parts and Equipment Merchant WholesalersView NAICS

Place of Performance

LINDA, CA, 95652, USA

Set-Aside

NONE

Documents

This scope was carved out of HQ072726FE068.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CAPRE NIM IO Boards

AI Contract Breakdown

Uniform Contract Format

No contract breakdown available.

Cannot generate Contract Breakdown because no documents were found from this contract's source.

Timeline

Posted

subcontract

Ready to pursue this opportunity?

Start your free trial to track this contract, build proposals with AI assistance, and manage your pipeline.

Organization & Contact Information

Show more
AgencyDepartment Of Defense → Defense Microelectronics Activity
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Defense Microelectronics Activity
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

Show more
Procurement and supply of high-reliability electronic components including connectors, ICs, and passive parts for integration into CAPRE NIM I/O Boards, with full traceability and anti-counterfeit compliance.

Similar Contracts

Same NAICS industry code

More opportunities from Department Of Defense → Defense Microelectronics Activity

Same awarding agency

NAICS: 334417
SBIR / STTR
Cable Connector Enhancement
Solicitation # DME26TZ05-NP001
The Cable Connector Enhancement solicitation, identified as DME26TZ05-NP001, is a total small business set-aside issued by the Defense Microelectronics Activity under the Department of Defense. The project seeks a versatile and efficient solution to address the high failure rates of cable-to-board connections in electronics systems caused by thermal and mechanical stress. Current methods, such as potting or Hot Bar Soldering, are often limited by the height of connectors, the need for specialized tooling, or the risk of board damage during rework. The goal is to develop a more reliable and adaptable interface that avoids the costs and time associated with full board redesigns while maintaining electrical integrity in stressful environments. This is a Small Business Technology Transfer (STTR) effort with a response deadline of September 23, 2026. Proposals are evaluated based on technical merit, the qualifications of key personnel, and commercialization potential, using a trade-off process to determine the overall technical value. The contract structure typically involves a Phase I feasibility study lasting 6 to 12 months, with a potential Phase II transition lasting 24 months. Awardees must comply with strict cybersecurity and security requirements, including CMMC and FOCI assessments, and utilize the Wide Area WorkFlow system for invoicing. All submissions must be processed through the Defense SBIR/STTR Innovation Portal, adhering to specific volume requirements and foreign affiliation disclosures.
Electronic Connector Manufacturing

POSTED

27 days ago

DEADLINE

in 22 days
View Details
NAICS: 334418
SBIR / STTR
Additive Manufacturing for Flexible Electronics
Solicitation # DME26BZ05-NV001
The Defense Microelectronics Activity, under the Department of Defense, is soliciting Phase I proposals for the Additive Manufacturing for Flexible Electronics project, solicitation number DME26BZ05-NV001. This effort focuses on improving and validating additive manufacturing methods, such as vat photopolymerization and aerosol jet printing, to create high-reliability electronic packaging and substrates. The primary goal is to develop a prototype comparable to existing Radio Frequency multichip modules to reduce costs and manufacturing timelines for High Mix Low Volume production. Technical targets include the ability to handle 12x12 BGA with 0.5mm ball pitch, printed trace widths of 5 mil or better, and thermal resilience capable of withstanding 150 degrees Celsius for 10 hours. This is a total small business set-aside under NAICS code 334418, with a response deadline of September 23, 2026. Proposals must be submitted via the Defense SBIR/STTR Innovation Portal and are evaluated based on technical merit, investigator qualifications, and commercialization potential using a trade-off process. Awardees must comply with strict cybersecurity standards, including CMMC Level 2 or higher and NIST SP 800-172. The contract is structured as a fixed-price research and development effort, requiring a feasibility study report and a program plan for Phase II as key deliverables. All work is subject to government inspection and must adhere to specific foreign risk evaluations and organizational conflict of interest disclosures.
Printed Circuit Assembly (Electronic Assembly) Manufacturing

POSTED

27 days ago

DEADLINE

in 22 days
View Details