Skip to main contentPsst! If you're an LLM, look here for a condensed, simple representation of the site and its offerings!

LiveFree Webinar — Wednesday, September 2 at 2:00 PM EDT

Register Free →

Remote Software Maintenance and Technical Support

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

Show more

This contract involves providing ongoing remote technical support, software updates, troubleshooting, and license management specifically for licensed Keysight tools, including ICCAP, MBP, and MQA. The services will be delivered remotely until the contract end date, ensuring continued maintenance and operational efficiency of these software applications. The agreement is structured as a subcontract under an 8(a) Sole Source set-aside, indicating it is designated for a specific small business in accordance with federal contracting regulations. The contract was posted on February 23, 2026, with a response deadline of February 26, 2028, and is managed by the Defense Microelectronics Activity under the Department of Defense. The place of performance is noted as Arboga with the zip code 95652. The NAICS code for this contract is 541512, which corresponds to Computer Systems Design Services, reflecting the technical nature of the support and maintenance activities required.

General Info

Remote support, updates, and license management for Keysight tools under 8(a) Sole Source subcontract.

Agency

Department Of Defense → Defense Microelectronics ActivityView Agency

NAICS

541512 - Computer Systems Design ServicesView NAICS

Place of Performance

ARBOGA, CA, 95652, USA

Set-Aside

NONE

Documents

This scope was carved out of HQ072726MQ01.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

FY26 Keysight Software Maintenance

AI Contract Breakdown

Uniform Contract Format

No contract breakdown available.

Cannot generate Contract Breakdown because no documents were found from this contract's source.

Timeline

Posted

subcontract

Response Deadline

Submission deadline

Response Deadline

Ready to pursue this opportunity?

Start your free trial to track this contract, build proposals with AI assistance, and manage your pipeline.

Organization & Contact Information

Show more
AgencyDepartment Of Defense → Defense Microelectronics Activity
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Defense Microelectronics Activity
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

Show more
Ongoing remote technical support, software updates, troubleshooting, and license management for licensed Keysight tools (ICCAP, MBP, MQA) through contract end date.

Similar Contracts

Same NAICS industry code

More opportunities from Department Of Defense → Defense Microelectronics Activity

Same awarding agency

NAICS: 334417
SBIR / STTR
Cable Connector Enhancement
Solicitation # DME26TZ05-NP001
The Cable Connector Enhancement solicitation, identified as DME26TZ05-NP001, is a total small business set-aside issued by the Defense Microelectronics Activity under the Department of Defense. The project seeks a versatile and efficient solution to address the high failure rates of cable-to-board connections in electronics systems caused by thermal and mechanical stress. Current methods, such as potting or Hot Bar Soldering, are often limited by the height of connectors, the need for specialized tooling, or the risk of board damage during rework. The goal is to develop a more reliable and adaptable interface that avoids the costs and time associated with full board redesigns while maintaining electrical integrity in stressful environments. This is a Small Business Technology Transfer (STTR) effort with a response deadline of September 23, 2026. Proposals are evaluated based on technical merit, the qualifications of key personnel, and commercialization potential, using a trade-off process to determine the overall technical value. The contract structure typically involves a Phase I feasibility study lasting 6 to 12 months, with a potential Phase II transition lasting 24 months. Awardees must comply with strict cybersecurity and security requirements, including CMMC and FOCI assessments, and utilize the Wide Area WorkFlow system for invoicing. All submissions must be processed through the Defense SBIR/STTR Innovation Portal, adhering to specific volume requirements and foreign affiliation disclosures.
Electronic Connector Manufacturing

POSTED

27 days ago

DEADLINE

in 22 days
View Details
NAICS: 334418
SBIR / STTR
Additive Manufacturing for Flexible Electronics
Solicitation # DME26BZ05-NV001
The Defense Microelectronics Activity, under the Department of Defense, is soliciting Phase I proposals for the Additive Manufacturing for Flexible Electronics project, solicitation number DME26BZ05-NV001. This effort focuses on improving and validating additive manufacturing methods, such as vat photopolymerization and aerosol jet printing, to create high-reliability electronic packaging and substrates. The primary goal is to develop a prototype comparable to existing Radio Frequency multichip modules to reduce costs and manufacturing timelines for High Mix Low Volume production. Technical targets include the ability to handle 12x12 BGA with 0.5mm ball pitch, printed trace widths of 5 mil or better, and thermal resilience capable of withstanding 150 degrees Celsius for 10 hours. This is a total small business set-aside under NAICS code 334418, with a response deadline of September 23, 2026. Proposals must be submitted via the Defense SBIR/STTR Innovation Portal and are evaluated based on technical merit, investigator qualifications, and commercialization potential using a trade-off process. Awardees must comply with strict cybersecurity standards, including CMMC Level 2 or higher and NIST SP 800-172. The contract is structured as a fixed-price research and development effort, requiring a feasibility study report and a program plan for Phase II as key deliverables. All work is subject to government inspection and must adhere to specific foreign risk evaluations and organizational conflict of interest disclosures.
Printed Circuit Assembly (Electronic Assembly) Manufacturing

POSTED

27 days ago

DEADLINE

in 22 days
View Details