This Government Contract opportunity from Department Of Defense was posted on July 26, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
ESD/EMI Protective Packaging and Materials Supply
Contract Overview
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AI Contract Overview
The contract seeks suppliers to provide electrostatic discharge and electromagnetic interference protective packaging materials that meet stringent military standards MIL-PRF-81705 and MIL-DTL-117, specifically designed for defense electronics applications. The required materials include barrier films, cushioning components, and custom-engineered containers to ensure complete protection against static discharge and electromagnetic interference during storage and transportation. All items must be manufactured to exacting specifications to safeguard sensitive military hardware, with compliance verified through documented testing and certification processes. The opportunity is structured as a subcontract under the Department of Defense’s Active Devices Division, with performance expected to occur in Columbus, Ohio, at the ZIP code 43213. Interested parties must submit proposals by the deadline of August 6, 2026, and the NAICS code 326199 applies, indicating classification under other plastic product manufacturing. While no set-aside designation is specified, the solicitation is open to qualified vendors capable of delivering compliant packaging solutions at scale, with no point of contact details provided in the solicitation materials. Access to the full request for quotation is available through the DIBBS portal.
General Info
Agency
NAICS
Place of Performance
COLUMBUS, OH, 43213, USASet-Aside
Documents
This scope was carved out of SPE7M5-26-T-354J.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
MICROCIRCUIT, DIGITA
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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Same awarding agency
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