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ESD/EMI Protective Packaging

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The contract requires the fabrication and application of electrostatic discharge and electromagnetic interference protective packaging using qualified barrier materials listed under QPL-81705 and compliant cushioning conforming to specification A-A-59136, specifically designed to safeguard sensitive microcircuit leads and terminals from damage during handling and transport. All materials and methods must meet strict military standards to ensure complete protection against static and interference-related failures, with work performed to maintain the integrity of electronic components throughout the supply chain. The contract is classified as a subcontract under NAICS code 326199, issued by the Active Devices Division of the Department of Defense, with performance required at a location in Columbus, Ohio, zip code 43213. Proposals must be submitted by August 20, 2026, and the solicitation was posted on August 9, 2026. No set-aside preferences are indicated, and while no point of contact is listed, the official bidding interface is accessible through the DIBBS portal using the reference number SPE7M526T398Y.

General Info

Fabricate and apply ESD/EMI protective packaging per military standards for microcircuits in Columbus, Ohio.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

326199 - All Other Plastics Product ManufacturingView NAICS

Place of Performance

COLUMBUS, OH, 43213, US

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

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Response Deadline

Submission deadline

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → ACTIVE DEVICES DIVISION
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Office AddressN/A
ContactsNo contact information available

Full Description

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Fabricate and apply ESD/EMI-protective packaging using qualified barrier materials (QPL-81705) and compliant cushioning (A-A-59136) to protect microcircuit leads and terminals.

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